Industry News: gold hardness porosity (Page 1 of 3)

Flex Circuits Can Be Supplied With Connectors

Industry News | 2003-04-09 08:25:50.0

A new design guide is available from Genalog detailing Samtec's flex circuit capabilities.

SMTnet

IPC Releases IPC-1755, Conflict Minerals Data Exchange Standard Establishes Requirements for Suppliers and their Customers

Industry News | 2014-04-11 09:15:04.0

IPC – Association Connecting Electronics Industries®, working in partnership with the Automotive Industry Action Group (AIAG), the Conflict-Free Sourcing Initiative (CFSI) and the Japan Electronics and Information Technology Industries Association (JEITA), recently published IPC-1755, Conflict Minerals Data Exchange Standard, to help suppliers and their customers effectively facilitate conflict minerals data exchange along the entire global supply chain.

Association Connecting Electronics Industries (IPC)

Immersion gold VS Plating gold

Industry News | 2019-05-16 01:27:23.0

There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious treatment. Many people can't tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake. The following is a brief introduction to the difference between plating gold and immersion gold.

Headpcb

Gold Plating Services in Santa Clara CA Installs Technic ENEPIG Process

Industry News | 2016-06-10 09:45:09.0

Cranston RI - Technic is pleased to announce the installation of the TechniPad Electroless Palladium process AT7015 at Gold Plating Services (GPS) in Santa Clara CA. GPS is a contract plating service specializing in precious metal plating for the printed circuit board industry.

Technic Inc.

Guideline for wire bonding

Industry News | 2019-11-05 22:19:03.0

> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.

Headpcb

Do You Own the Oldest M.O.L.E.®? Enter to Win a SuperM.O.L.E.® Gold 2 kit

Industry News | 2012-11-05 14:21:13.0

ECD is digging deep to find the oldest M.O.L.E.® so scour your plant for a vintage, working M.O.L.E.® thermal profiler and enter our contest to Win a New SuperM.O.L.E.® Gold 2 Kit

Electronic Controls Design Inc. (ECD)

Dow Corning Gold Award Goes to Krayden Again

Industry News | 2013-03-06 17:59:10.0

Dow Corning has named Krayden Inc. as the recipient of the Gold Level Distributor in Electronics. This commemorates the first time this prestigious award has been bestowed upon a single distributor 5 times by Dow Corning North America Electronics Channel.

Krayden Inc.

Kyzen Achieves Gold Supplier Rating from L-3 Communications Display Systems

Industry News | 2012-02-06 23:17:29.0

Kyzen achieved the status of Gold Supplier from L-3 Communications Display Systems.

KYZEN Corporation

Different Techniques for Plating

Industry News | 2018-10-18 11:08:03.0

Different Techniques for Plating

Flason Electronic Co.,limited

Dow Corning Electronics Awards Krayden Inc. as its North American 2008 Distributor of the Year

Industry News | 2009-01-30 19:36:20.0

DENVER � January 2009 � Krayden, Inc., a leading distributor of engineered materials, announces that the Dow Corning Americas Electronics Channel Team named Krayden, Inc. as the recipient of the Distributor of the Year Award and GOLD level status for 2008.

Krayden Inc.

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