Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2013-11-20 16:36:43.0
Everett Charles Technologies (ECT) announced today that the .4mm and .5mm ZIP® Z0 and Z1 performance production contacts are now available in the high-performance HyperCore™ base material.
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
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