Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2018-10-18 09:06:41.0
Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors
Industry News | 2003-07-09 09:11:37.0
Release of the first revision to the standard that forms the foundation of IPC�s family of design standards (IPC-2220)
Industry News | 2018-10-18 11:01:38.0
What Design Files Are Necessary for PCB Manufacturing & Assembly?
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2019-08-27 23:44:30.0
Seica will be exhibiting at the Rosemont, IL Conference and Convention Center on September 24-25 in booth 415. On exhibition will be Seica's new desktop Dragonfly AOI inspection system, which utilizes leading-edge LED technology to perform conformal coat and through-hole-technology inspection, including presence checks of pins and solder, effectively combining two distinct inspection processes in a single machine.
Industry News | 2016-12-29 06:43:55.0
Conformal Coating Photo Album CD-ROM The photo CD-ROM album featuring over 280 colour images on conformal coating, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents and standards. The photo CD covers many of the defects listed:
Industry News | 2011-04-06 13:13:52.0
Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.
Circuit Technology Center, Inc.
winsouce.jpg)
