Industry News: gold wirebonding (Page 1 of 1)

Barry Industries Introduces Compact 3/4W Chip Attenuator for Ku, K & Ka Bands

Industry News | 2013-10-25 16:15:31.0

Barry Industries introduces a new 0904 size chip attenuator for Ku, K and Ka bands. The AV0904GA attenuator has been characterized to 30GHz, features gold wirebondable I/O terminals with epoxy mount ground pads and is rated to 750mW.

Barry Industries, Inc.

San Francisco Circuits Now Offers Micro-Circuits

Industry News | 2012-09-10 19:45:44.0

San Francisco Circuits is now offering Micro-Circuits.

San Francisco Circuits

San Francisco Circuits to Exhibit at PCB West 2012

Industry News | 2012-09-10 20:15:43.0

San Francisco Circuits will be exhibiting at PCB West 2012.

San Francisco Circuits

Perllo Technologies Introduces Extec�s new line of Steel-Inked and 3-D Thick Film Hybrid Technology into US Marketplace

Industry News | 2004-11-19 15:47:39.0

Perllo Technologies LLC is pleased to announce its new partnership with Extec Integrated Systems Limited ("Extec") of Hampshire, United Kingdom.

Perllo Technologies

Machine Vision Products announced as winner of “Best New Product – USA” category at the Global Technology Award ceremony at SMTAi.

Industry News | 2012-10-16 21:44:41.0

Carlsbad, CA – October 16, 2012: Machine Vision Products (MVP), a leader in Automated Optical Inspection, is proud to announce that their 850G DW metrology based AOI has won the award for Best New Product – USA at the award ceremony held at the SMTA International show in Orlando, Florida. The Global Technology Awards are hosted by Global SMT and Packaging Magazine.

Machine Vision Products, Inc

New Viscom 3D AOI line-up and 360View feature for improved 3D inspection

Industry News | 2016-07-26 18:48:27.0

Viscom today announced plans to introduce its new 3D AOI line-up to Asian markets, highlighting its new 360View feature in Stand 1F35 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Centre.

Viscom AG

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