Industry News | 2021-04-13 17:37:07.0
Gold plating dissolves rapidly during soldering and can result in gold embrittlement. This tech paper examines how to re-condition electronic components prior to soldering.
Industry News | 2019-06-28 14:40:30.0
Siborg Systems Inc. gave the first viewing of LCR-Reader-MPA for the first time in Korea from May 15- 17 2019
Industry News | 2012-04-26 20:20:29.0
New model of the Digital Multimeter Smart Tweezers has been released. The main difference between the old and the new model of Smart Tweezers is a Li-Ion rechargeable battery and a 4-wire connection (Kelvin probe) brought up to the gold-plated tweezer tips. This significantly reduces noise and therefore improves accuracy by about 6 times to better than 0.5%.
Industry News | 2013-11-20 16:36:43.0
Everett Charles Technologies (ECT) announced today that the .4mm and .5mm ZIP® Z0 and Z1 performance production contacts are now available in the high-performance HyperCore™ base material.
Industry News | 2014-05-16 12:25:04.0
Siborg Systems Inc. has released a new budget model of popular handheld LCR-meter
Industry News | 2014-05-16 12:37:30.0
Siborg Systems Inc. releases Smart Tweezers ST-5S, an updated model of the popular ST-5 model.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2008-07-30 23:24:03.0
COLORADO SPRINGS, CO � July 29, 2008 � Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, introduces the VSPT0803 small part tip.
Industry News | 2011-02-26 14:35:16.0
Ironwood Electronics has recently introduced a new high performance WLCSP socket for 0.5mm pitch 40 ball WLCSP and 0.4mm pitch 30 ball WLCSP accommodated in the same socket.
