Industry News: gold-tin solder (Page 1 of 1)

Indium Corporation Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016

Industry News | 2016-01-05 14:46:38.0

Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.

Indium Corporation

SMART Group Launches Next FREE Guide in the Series: PCB Surface Finish Defect Guide

Industry News | 2017-04-04 15:22:45.0

SMART Group announces that the “Printed Circuit Solderable Finish Defect Guide” has been printed and is available free of charge.

The SMART Group

StratEdge Features Packages for the Extreme Demands of GaN and GaAs Devices at IMS2018 in Booth 1649

Industry News | 2018-06-04 18:18:26.0

StratEdge Corporation will feature its new line of packages that meet the extreme demands of gallium nitride (GaN) and gallium arsenide (GaAs) devices at the 2018 International Microwave Symposium. StratEdge packages meet the critical requirements of the telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS markets.

StratEdge Corporation

Micralyne Scientist Wins Second Award for AuSn Solder Research

Industry News | 2004-10-05 14:52:25.0

Dr. Siamak Akhlaghi has received a Silver Medal Award from the American Electroplaters and Surface Finishers Society

Micralyne Inc.

FINETECH to Showcase Modular Die Bonder at IMAPS 2011 – Long Beach

Industry News | 2011-09-12 13:16:36.0

FINETECH will showcase the FINEPLACER® Lambda in Booth #306 at the upcoming IMAPS 44th International Symposium on Microelectronics exhibition

Finetech

High-Accuracy R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 – San Diego

Industry News | 2012-09-05 08:13:47.0

Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition

Finetech

Microtek Adds FINEPLACER® Lambda Die Bonder to New Facility

Industry News | 2016-07-25 15:46:30.0

Finetech, a global supplier of micro-assembly equipment, and Microtek, a microelectronics product development innovator, announce the addition of a FINEPLACER® Lambda bonding system at the recently opened Microtek facility. The die bonder will be used for customized packaging applications in prototype and development projects, including wireless, photonics and medical diagnostics and therapeutics.

Microtek, Inc.

Difference between vacuum vapor reflow welding and hot air reflow welding

Industry News | 2019-12-16 22:47:11.0

The difference between gas phase reflow welding and hot air reflow welding is that gas phase reflow welding USES vapor phase liquid to heat the key.

Beijing Technology Company

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