Industry News: grid (Page 1 of 32)

'T' Series Bi-Metal Cutouts

Industry News | 2003-04-04 07:39:52.0

Designated T11L these have soldered connections for PCB circuits with a grid of 0.2 pitch

SMTnet

Connector Range has Board-to-cable Options Covered

Industry News | 2003-03-13 08:19:18.0

The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.

SMTnet

Card-to-cable Connector Meets QS9002 Standard

Industry News | 2003-02-20 08:04:10.0

The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.

SMTnet

California Micro Devices Announces Enhanced EMI Filtering with ESD Protection for GSM Handsets

Industry News | 2003-02-25 09:10:01.0

The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.

SMTnet

Circuit World Announces License of Channel Routing Technology from Nortel Networks

Industry News | 2003-06-25 12:40:26.0

to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks

SMTnet

What is a Ball Grid Array?

Industry News | 2018-10-18 10:22:15.0

What is a Ball Grid Array?

Flason Electronic Co.,limited

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

IPC’s Revised BGA Guideline Features Expanded Focus on Mechanical Reliability

Industry News | 2013-01-30 17:54:43.0

Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.

Association Connecting Electronics Industries (IPC)

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