Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2012-01-30 14:42:25.0
IPC’s recently published biennial wage and salary survey for the EMS industry shows a cautious upturn in salary increases in 2011, compared to 2009. Reporting on data from 151 U.S. and Canadian EMS facilities, IPC Wage Rate & Salary Study for the North American EMS Industry 2010-2011 is a valuable tool for EMS companies to gauge their position in competing for the best talent in the industry.
Industry News | 2012-08-02 11:47:58.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.
Industry News | 2013-05-06 18:48:35.0
IPC – Association Connecting Electronics Industries® announces an ambitious technical agenda for the IPC/FED Conference on Embedded Components.
Industry News | 2020-03-26 17:13:31.0
On behalf of electronics manufacturers in the United States and around the world, IPC thanks the U.S. Congress and the Trump administration for reaching agreement today on a $2 trillion economic stabilization package to address the fallout from the COVID-19 pandemic.
Industry News | 2023-10-30 12:09:07.0
IPC invites technical innovators, students engaged in research, academic researchers, and industry leaders to submit abstracts for technical poster presentations for the 16th Electronic Circuits World Convention (ECWC16) at IPC APEX EXPO 2024. Dedicated poster presentation networking session and poster judging are scheduled for April 9 from 5:00-6:00 pm. Once again, poster presentations will take place on the APEX EXPO show floor, maximizing visibility from an audience of industry peers.
Industry News | 2009-07-24 14:12:49.0
Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.
Industry News | 2011-04-07 18:29:45.0
After its successful launch in 2010, the IPC Foundation Silent Auction will return to IPC APEX EXPO™, April 12–14, 2011, in Las Vegas. Proceeds of the Silent Auction directly fund IPC Foundation initiatives, such as the All-Academic Poster Competition and technical conference scholarships.
Industry News | 2012-03-30 06:27:10.0
The SMTA Capital Chapter is pleased to announce the upcoming SMTA meeting at ZESTRON America on 12 April 2012 from 3:30 pm until 7 pm.
Industry News | 2019-02-26 18:23:53.0
Representing the views of more than 2,500 U.S. companies engaged in the global electronics industry, and their nearly 1 million workers, IPC – Association Connecting Electronics Industries, is joining the new USMCA Coalition. which is being launched today in Washington by the U.S. Chamber of Commerce.
