Industry News: gsm and boards (Page 3 of 151)

MIRTEC to Exhibit Extensive Range of AOI, SPI, X-ray and Specialized LED Inspection Systems at IPC APEX 2012

Industry News | 2012-01-23 00:02:12.0

MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.

MIRTEC Corp

MIRTEC to Exhibit Complete Line of 3D AOI, SPI and LED Inspection Systems at IPC APEX 2013

Industry News | 2013-01-16 11:21:12.0

MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI and LED Inspection Systems at IPC APEX 2013

MIRTEC Corp

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2015

Industry News | 2015-01-21 21:05:20.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #2333 at the 2015 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 24–26, 2015 at the San Diego Convention Center.

MIRTEC Corp

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Count On Tools Introduces Universal Instruments’ GSM Special Low Force Nozzle with Replaceable Tips for Delicate Components

Industry News | 2010-05-20 12:47:37.0

GAINESVILLE, GA ― Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces Universal Instruments’ GSM special low force (spring suspended) nozzle with replaceable tips for delicate components. Count On Tools’ new low force nozzles are ideal for gaas die, gallium arsenide, thin silicone (less than 0.10" in thickness), die with air bridges and flip chips.

Count On Tools, Inc.

FREE Soldering and Assembly Defects - Causes and Cures Webinar

Industry News | 2010-12-01 14:28:16.0

With hundreds of opportunities for problems to surface during the electronics manufacturing process, it is a credit to the manufacturing and engineering talent of the industry that planes fly, pacemakers keep hearts beating and phones are at the ready to provide Facebook updates or even make a call. To keep these dedicated professionals up-to-date on the latest causes and cures for assembly and solder defects, IPC and the U.K. National Physical Laboratory (NPL) have teamed up to sponsor a free webinar at 12:00 pm (noon) U.S. Central time on January 27, 2011 — a precursor to the hands-on, three-day Process Defects Clinic that will be held at IPC APEX EXPO in April.

Association Connecting Electronics Industries (IPC)

IPC/WHMA-A-620 Training and Certification Centers Up and Running

Industry News | 2003-06-18 07:47:47.0

The training certification program, which assures its participants immediate industry recognition, legitimacy and value, is designed to train operators and potential instructors on proper cable and wire harness fabrication and installation.

Association Connecting Electronics Industries (IPC)

Count On Tools Introduces Ceramic Nozzles for UIC’s Placement Equipment

Industry News | 2011-01-28 17:29:19.0

Count On Tools Inc. introduces new Ceramic Nozzle Series for the complete line of Universal Instruments Corporation’s (UIC) pick-and-place machines, including Genesis, Advantis, Flexjet and GSM.

Count On Tools, Inc.

IPC and Northrop Grumman Sponsor HDI Conference

Industry News | 2011-01-20 13:54:40.0

IPC will host the IPC Conference on HDI: Strategies for the 21st Century on March 1–2, 2011, at the National Electronics Museum in Baltimore, Md. Sponsored by Northrop Grumman Corporation, the two-day event includes technical workshops on March 1 and a full-day technical conference on March 2.

Association Connecting Electronics Industries (IPC)


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