Industry News: gsm axis enabled (Page 1 of 32)

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

MIRTEC Announces Technical Collaboration Agreement with YXLON and The Comet Group

Industry News | 2018-08-21 20:05:28.0

MIRTEC, ‘The Global Leader in Inspection Technology’, is pleased to announce it has entered into a Technical Collaboration Agreement with YXLON, a company of the Comet Group. This collaboration allows both organizations to explore and expand upon synergistic applications within the SMT Electronics Manufacturing Industry.

MIRTEC Corp

NEMI's Test Strategy Project Releases Cost Model

Industry News | 2003-05-22 08:54:17.0

Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies

SMTnet

Nordson ASYMTEK Receives 2015 Global Technology Award for Programmable Tilt + Rotate 5-Axis Fluid Dispenser

Industry News | 2015-12-01 10:08:02.0

Nordson ASYMTEK has been honored with the 2015 Global Technology Award in the dispensing category for its Programmable Tilt + Rotate 5-Axis Fluid Dispenser. The award was presented at the Productronica expo, in Munich, Germany on November 10, 2015.

ASYMTEK Products | Nordson Electronics Solutions

Nordson ASYMTEK's Programmable Tilt + Rotate Uses 5 Axes for Fluid Dispensing

Industry News | 2015-07-08 14:20:26.0

Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. The additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages, while meeting stringent requirements for precision, accuracy, and speed. It enables dispensing of underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides precision fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages.

ASYMTEK Products | Nordson Electronics Solutions

Nordson ASYMTEK Introduces New Spectrum II S2-900 Series High Speed, High Accuracy, Precision Dispensing System

Industry News | 2013-11-05 23:02:54.0

Nordson ASYMTEK will introduce the Spectrum™ II at Productronica this year, marking the 6-year anniversary of the introduction of the Spectrum series of high-speed, high-accuracy dispensing platforms. The Spectrum II S2-900 Series leverages the same small footprint of 600mm x 1321mm as the original Spectrum to provide maximum productivity with minimum manufacturing floor space, but improves the precision, accuracy, and speed of the system to rival much larger platforms.

ASYMTEK Products | Nordson Electronics Solutions

Count On Tools Expands to Meet Growing Market Demand

Industry News | 2011-08-10 19:59:23.0

Count On Tools recently expanded the manufacturing operations at its Gainesville, GA headquarters in response to the growing market for SMT nozzles and consumables.

Count On Tools, Inc.

HEI, Inc. Invests in Advanced PCB Production Capabilities to Support Expansion

Industry News | 2012-04-09 13:27:45.0

HEI and Orbotech announced that HEI has taken delivery of and qualified the Paragon™ 9800 Laser Direct Imaging (LDI) system, Ultra Discovery™ Automated Optical Inspection (AOI) system as well as InPlan®Flex and GenFlex® CAM/Engineering software.

HEI Inc.

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