Industry News: gsm field engineer (Page 4 of 96)

Hutchins Grant Award Winner Announced

Industry News | 2012-11-20 17:32:47.0

During the 2012 Annual Meeting at SMTA International, the SMTA announced that Xian Qin, a graduate student at Georgia Institute of Technology, has been selected as the recipient of the 2012 Charles Hutchins Educational Grant.

Surface Mount Technology Association (SMTA)

SMTA Seeks Donations for Hutchins Grant and Stromberg Scholarship

Industry News | 2021-12-01 15:56:50.0

The SMTA is seeking donations for the Charles Hutchins Grant and JoAnn Stromberg Student Leader Scholarship for the upcoming year. Both of these awards are made possible exclusively through donations by businesses and individuals.

Surface Mount Technology Association (SMTA)

2022 Charles Hutchins Educational Grant Winner Announced

Industry News | 2022-10-20 06:56:33.0

SMTA is honored to announce Rajesh Sharma Sivasubramony, a graduate student at Binghamton University, has been selected as the winner of the 2022 Charles Hutchins Educational Grant.

Surface Mount Technology Association (SMTA)

IPC And NPL Team Up To Solve Industry Process Issues With Free Defect Clinic At IPC APEX Expo 2011

Industry News | 2011-02-09 14:50:49.0

Manufacturing and quality engineers looking for solutions to process challenges will have an additional resource for answers with the new Process Defect Clinic at the IPC APEX EXPO conference and exhibition, April 12–14, 2011, in Las Vegas. Sponsored by IPC and the National Physical Laboratory (NPL), the free clinic will be held in booth 217 on the show floor to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.

Association Connecting Electronics Industries (IPC)

IPC Celebrates 5th Annual Manufacturing Day

Industry News | 2016-10-09 21:12:54.0

IPC is proud to celebrate today’s 5th annual Manufacturing Day, alongside a group of industry sponsors and co-producers. On this day, manufacturers around the country are joining in a unified effort to highlight current innovations in the electronics industry and inspire the next generation of manufacturing professionals.

Association Connecting Electronics Industries (IPC)

Hutchins Grant Award Winner Announced

Industry News | 2015-12-05 16:08:55.0

During the 2015 Annual Meeting at SMTA International, the SMTA announced that Hanju Oh, a graduate student at Georgia Institute of Technology, has been selected as the recipient of the 2015 Charles Hutchins Educational Grant. The SMTA Grant Committee selected his project entitled "A Three-Dimensional Packaging Platform with Integrated Microfluidic Cooling."

Surface Mount Technology Association (SMTA)

Hutchins Grant Award Winner Announced

Industry News | 2016-11-22 17:42:42.0

During the 2016 Annual Meeting at SMTA International, the SMTA announced that Kate Reeve, a graduate student at Purdue University, has been selected as the recipient of the 2016 Charles Hutchins Educational Grant. The SMTA Grant Committee selected her project entitled "Heterogeneous Nucleation of ß-Tin in Lead-Free, Tin-Based Solder Alloys."

Surface Mount Technology Association (SMTA)

Women’s Leadership Program at SMTA International

Industry News | 2017-09-06 13:36:35.0

SMTA is proud to announce the Women's Leadership Program at SMTA International. The program takes place from 1:30pm-5:00pm on Monday, September 18, 2017 during the SMTA International Conference and Exhibition in Rosemont, Illinois.

Surface Mount Technology Association (SMTA)

IPC Launches Three Cutting-Edge Online Instructor-led Courses to Empower Electronics Industry Professionals

Industry News | 2023-06-19 13:46:06.0

IPC announces the launch of three new online courses designed to equip professionals with valuable knowledge and skills in the rapidly evolving electronics sector. Available on IPC's online education platform, IPC EDGE, these new courses will provide industry experts and enthusiasts with opportunities for growth and development.

Association Connecting Electronics Industries (IPC)

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)


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