Industry News | 2011-04-22 21:54:12.0
The Capital Chapter is announcing its next SMTA meeting to be held at APL, Johns Hopkins University, in Laurel MD on May 17, 2011 from 5pm-8pm.
Industry News | 2009-07-16 14:35:03.0
POWAY, CA — July 2009 — EasySpheres LLC features Kester’s 959T no-clean, non-corrosive, halide-free Flux Pen®.
Industry News | 2019-04-01 19:56:55.0
SHENMAO America, Inc. provides a variety of solder paste products for SMT assembly including Tin Lead Solder Paste, Lead-Free Solder Paste, Water-Soluble Solder Paste, Package-on-Package Solder Paste, Low-Temperature Solder Paste, and Halogen-Free Solder Paste.
Industry News | 2018-07-19 20:30:51.0
SHENMAO America is pleased to introduce the PF606-PW215 water-soluble solder paste. The company offers a full line of water-soluble fluxes and solder pastes for SMT and IC packaging applications. SHENMAO provides halide-containing and halide-free fluxes for tin/lead as well as lead-free solder alloys.
Industry News | 2004-12-15 10:46:13.0
Indium Corporation of America released its newest Wave Solder Flux called
Industry News | 2020-04-18 13:46:46.0
Kurtz Ersa Inc. is pleased to announce that it is offering Interflux's SelectIF 2040 and PacIFic 2009M VOC-free fluxes. Due to the recent demand for isopropyl alcohol, many companies are changing to water-based (VOC-free) fluxes instead of alcohol-based fluxes for their selective soldering and wave soldering processes.
Industry News | 2019-05-27 21:16:27.0
SHENMAO America, Inc. introduces PW215 Water Soluble Solder Paste, ideal for SMT and IC packaging applications. With a wide reflow window, this water soluble solder paste can effectively fit into the design process for even the most complex SMT or IC assembly substrate designs.
Industry News | 2014-09-22 17:51:09.0
he Balver Zinn Group introduces the new Bi Rework Solder Paste (de-soldering paste). The desoldering paste has been designed for desoldering Pb-free components and is ideal for LED removal.
Industry News | 2009-07-28 12:23:26.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Industry News | 2009-07-30 21:06:08.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
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