Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2018-12-08 03:25:54.0
Basic Soldering Guide – How to Solder Electronic Components
Industry News | 2003-05-12 08:52:56.0
September 21-25, Donald Stephens Convention Center, Rosemont, IL
Industry News | 2011-12-14 15:47:27.0
Featuring new research and innovations in printed board design and manufacturing, electronics assembly and test, the IPC APEX EXPO® technical conference will be held at the San Diego Convention Center, February 28-March 1, 2012.
Industry News | 2018-12-08 03:38:44.0
Lead-Free (Pb-Free) Solder and Composition
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2007-10-05 21:28:08.0
MINNEAPOLIS, MN - During the Annual Meeting at SMTA International (Wednesday, October 10th, at the Gaylord palms Resort in Orlando, FL.), the association honored members who have shown exceptional service to the association and the industry.
Industry News | 2008-09-21 02:27:24.0
Minneapolis, MN � During the Annual Meeting at SMTA International, August 20 at Disney's Coronado Springs Resort and Convention Center in Orlando, FL, the SMTA honored members who have shown exceptional service to the association and the industry.
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
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