Industry News | 2021-08-13 12:08:30.0
Online training for new, recently hired, and transitioning engineers
Industry News | 2020-02-18 14:31:52.0
Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.
Industry News | 2018-12-08 03:27:35.0
Printed Circuit Board (PCB) for Surface Mount Technology (SMT)
Industry News | 2017-03-31 17:21:11.0
IPC – Association Connecting Electronics Industries®, is proud to announce the growing involvement of the Connected Factory Exchange (CFX). The 2-17 Connected Factory Initiative Subcommittee is comprised of representatives of the electronic industry’s leading manufacturers, machine, device, sensor and software companies.
Industry News | 2024-09-16 19:59:33.0
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC's Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, "Advanced Packaging to Board Level Integration--Needs and Challenges."
Industry News | 2024-10-13 18:41:25.0
New white paper serves as a blueprint for strengthening PCB assembly capabilities in the United States
Industry News | 2011-02-24 21:39:40.0
The assembly of solar panels is very similar to the assembly of printed boards, making solar power a hot opportunity for electronics assemblers. A small but growing market, solar module production is projected to increase 273% from 2010 to 2014, according to iSuppli. Shedding some light on the rapidly advancing business of solar panel assembly, IPC will host the Solar Assembly and Solar Living Pavilion on the show floor at IPC APEX EXPO, April 12–14, 2011, in Las Vegas.
Industry News | 2016-04-20 18:15:34.0
Nordson ASYMTEK will present a triple-valve, closed-loop system to jet conformal coating, a UV oven to cure it, and an automated coating inspection system to verify the coating results at the SMT Hybrid Packaging Show in Nuremberg, Germany, in the smartTec stand 7-109 from 26-28 April 2016. Nordson ASYMTEK's award-winning Quantum® Q-6800 high-performance, large-format dispensing system will jet underfill as part of the show's Future Packaging Line at stand 6-434.
Industry News | 2012-03-24 10:06:28.0
NEPCON China Becomes a Platform for the Debut of New Product Releases in Asia
Industry News | 2012-03-13 10:52:10.0
Rosenheim, Germany, March 2012: Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that it has expanded its MEMS portfolio to pick-and-place applications with the introduction of its test and calibration cart for the MT9510. Multitest MEMS solutions now are available for strip test and singulated package test –on Multitest InStrip® with optional InCarrier™, the well-established gravity test handlers MT93xx and MT9928, or the MT9510XP tri-temp pick-and-place handler.
