Industry News | 2010-11-02 10:42:48.0
Christopher Associates today announced the US introduction of Koki’s S3X48-M500 and S3X48-M500C Printable No-Clean Lead-Free Solder Pastes. Originally designed and formulated for superior head-in-pillow performance, the pastes also exhibit exceptional wetting and printing.
Industry News | 2008-02-04 11:15:15.0
The European Institute of Printed Circuits (EIPC) extends an invitation to companies and individuals active in the Packaging and Interconnection Industry to submit abstracts for presentation at their Summer Conference which is to be held onMay 29 & 30 2008 in Dresden, Germany.
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