Industry News | 2022-09-30 11:07:14.0
Each year, IPC APEX EXPO features industry's most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2023 will feature Emily Calandrelli, host and co-executive producer of the hit Netflix series "Emily's Wonder Lab," host and executive producer of FOX channel's "Exploration Outer Space" and author of the children's chapter book series, "The Ada Lace Adventures." During her keynote on January 24, Calandrelli will present, "The Sustainability, Economics and Advocacy of Space Exploration."
Industry News | 2009-03-10 00:30:31.0
Siemens Electronics Assembly Systems will introduce the Siplace X-Series powered by the new Siplace CPP MultiStar placement head at APEX 2009 in Booth #1458. The new Siplace X-Series powered by Siplace MultiStar delivers the ideal combination of chip shooting speed along with extensive component range capability required for flexible end of line placement. This �all-in-one� solution, called Collect & Pick & Place (CPP) enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.
Industry News | 2015-11-04 20:05:54.0
Saki Corporation announces that its new 3D automated optical inspection, solder paste, and x-ray technology and equipment will be demonstrated at Productronica 2015, in Stand A2.239, as part of the theme "From Inspection to Measurement."
Industry News | 2016-05-13 11:56:03.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
Industry News | 2016-05-13 12:00:12.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
Industry News | 2018-09-05 20:16:30.0
Engineered Material Systems debuts CA-188-1 low-temperature cure electrically conductive adhesive for die attach and general circuit assembly applications.
Industry News | 2009-01-30 18:39:51.0
S-series tape feeders have been one of the most important components of many Siplace placement machines for many years. With its new 3x8 mm shutterless S-feeder, Siemens Electronics Assembly Systems (SEAS) now presents another improved version in the series. Fewer movable parts mean longer life and more reliability. The new feeder also handles a broader spectrum of components and makes the user's job easier. As a special benefit, owners of classic 3x8 mm feeders can have them upgraded to the shutterless version.
Industry News | 2015-03-02 09:42:34.0
PORTLAND, MAINE – VisionMaster® introduced the first member of the VisionMaster 600 family, the latest in the evolution of the original VisionMaster® world-class benchtop SPI systems at APEX. The fully-automatic A600 features the smallest 3D non-contact SPI sensor head in the world, which was crafted by miniaturizing the technology in the popular A500X. A smaller sensor translates to a more efficient motion system, lower vibrations and settling time – which results in higher accuracies at higher speeds. A600's fully automatic set-and-forget SPI system is optimal for monitoring and tweaking your solder paste printing process. The standard A600 handles larger board sizes – 18 in. x 16 in. – and is very economical at $29,999.
Industry News | 2003-02-21 18:48:56.0
Machine Vision Products, Inc. (MVP), global leader in automated optical inspection (AOI) and process control solutions, today has announced that it will introduce its new Supra inspection system at APEX 2003, in Anaheim, California, March 31 through April 2.MVP will introduce its new Supra inspection system at APEX 2003.
Industry News | 2013-01-21 08:57:51.0
Engineered Material Systems debuts its 561-50 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices
winsouce.jpg)
