Industry News: heat and seal (Page 8 of 41)

MacDermid Alpha Launches Ultra-Low Temperature Solder and 5G Solutions at Productronica China 2020

Industry News | 2020-06-24 15:22:46.0

The Assembly Solutions division of MacDermid Alpha Electronics Solutions will be introducing its ultra-low temperature solder and 5G solutions at the Productronica China show from July 3-5, 2020, at the National Exhibition and Convention Center in Shanghai.

MacDermid Alpha Electronics Solutions

Nordson to exhibit many new solutions for electronics manufacturing at Productronica 2017

Industry News | 2017-11-07 17:14:32.0

Nordson Corporation (NASDAQ: NDSN) announces that eight divisions from its Advanced Technology segment will be exhibiting together at Productronica, the world's leading trade fair for electronics development and production, to be held in Munich, Germany during November 14-17, 2017, in Hall A2, stands 245, 345, and 445.

Nordson Corporation

Krayden Debuts Dow Corning Solar Solutions’ Solar Junction Box and Frame Sealing Using Reactive Silicone Hot Melts

Industry News | 2010-06-04 17:32:40.0

DENVER — Krayden, Inc., a leading silicone supplier that specializes in technical knowledge and support for high tech-based applications, introduces Dow Corning Solar Solutions’ PV InstantSeal. This silicone reactive hot melt supports higher-speed assembly with instant green strength, offering productivity improvements in both solar frame and junction box sealing.

Krayden Inc.

Christopher Associates and Shoda Techtron Enter LED Lighting Market with New Substrate Coating Technology

Industry News | 2011-03-31 11:12:08.0

Christopher Associates Inc. announces a new solution for coating and sealing the edges of aluminum core LED panels. The UVP-630A edge coating system was developed by Shoda Techtron to automatically coat and cure chemically resistant coatings, protecting and sealing the substrate as it is processed through multiple steps.

Christopher Associates Inc.

Pin and Slant Fin Heat Sinks Offer Economical Electronics Cooling

Industry News | 2022-03-09 12:37:18.0

Pin and Slant Fin Heat Sinks Offer Economical Electronics Cooling

Advanced Thermal Solutions, Inc

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Industry News | 2016-09-08 13:30:10.0

Engineered Material Systems is pleased to introduce the DF-3520 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Industry News | 2017-01-09 18:11:30.0

Engineered Material Systems is pleased to introduce the DF-3560 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

Reliable Electronics Despite Heat and Cold

Industry News | 2016-01-20 10:43:07.0

With “Securo”, Rehm Thermal Systems offers a new series for reliable hot and cold function tests Electronic components in safety-relevant applications such as medical, automotive and aerospace technology must function 100 % reliably under all temperature conditions. To analyse the reliability of electronics under extreme temperatures, Rehm Thermal Systems has developed a completely new series: Securo Plus for hot function tests and Securo Minus for cold function tests. The systems can simulate precisely these extreme environmental conditions by selectively heating or cooling the component.

APROS Int. Consulting & Services

BTU to Discuss Furnaces for Precision Temperature / Atmosphere Applications at ASM’s Heat Treat 2015

Industry News | 2015-09-22 20:26:53.0

BTU International today announced that it will exhibit at Heat Treat 2015, ASM’s Heat Treating Society Conference & Exhibition, scheduled to take place Oct. 21-22, 2015, at the Cobo Convention Center in Detroit, MI. BTU will highlight its controlled atmosphere furnaces in Booth #449.

BTU International


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