Industry News: heat sensitivity (Page 3 of 12)

Indium Corporation's Durafuse™LT EarnsMexico Technology Award

Industry News | 2020-10-31 10:39:48.0

Indium Corporation earned the Mexico Technology Award for its patent-pending Durafuse™ LT low-temperature alloy system.

Indium Corporation

Indium Corporation to Feature Low-Temp Alloy at Productronica China

Industry News | 2021-03-06 03:11:18.0

Indium Corporation will feature the award-winning Durafuse™ LT–the novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications–during Productronica China, held March 17-19 inShanghai, China.

Indium Corporation

New Laser Compression Bonder Provides Warpage-free Package Bonding

Industry News | 2021-07-08 05:33:04.0

Laserssel Co., LTD is pleased to introduce its CLSR 6000 high-end Laser Compression Bonder for semiconductor packages. This soldering technique uses high accuracy compression tools and Area Laser bonding introduced with LSRTM(Laser Selective Reflow) in order to minimize warpage on extremely thin packages and substrates. This technology has been adopted for high-end 2.5D packaging with dimensions larger than 60x60mm and NAND modules thinner than 50 µm.

Laserssel Corporation

Laserssel Wins TWO 2021 Mexico Technology Awards

Industry News | 2021-11-03 13:33:10.0

Laserssel Co., LTD is pleased to announce that it received two 2021 Mexico Technology Awards in the categories of Bonding Equipment for its LCB 3000 Laser Compression Bonder and Rework & Repair for its Laserssel rLSR Mini LED Rework System. The awards were announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.

Laserssel Corporation

A New Technology for Void-Free Reflow Soldering Is Now Available

Industry News | 2013-02-12 13:15:17.0

SEHO Systems GmbH now offers a new technology for virtually void-free soldering results with the MaxiReflow HP.

SEHO Systems GmbH

MacDermid Alpha to Promote Latest Interconnect Technologies and Present on Microvia Reliability at the 2021 Virtual IPC APEX Exhibition and Conference

Industry News | 2021-02-25 13:41:10.0

MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.

MacDermid Alpha Electronics Solutions

XDry Receives 2023 Mexico Technology Award for Innovative Heated Dry Cabinet

Industry News | 2023-10-31 19:02:32.0

XDry Corp. is pleased to announce that it received a 2023 Mexico Technology Award in the Dry Boxes category for its HXD2-1106-01 Heated Dry Cabinet. The announcement took place during the prestigious SMTA Guadalajara Expo on Wednesday, Oct. 25, 2023.

3M Electrical Solutions Division

JBC Tools Inc. to Exhibit at the 2011 IPC APEX EXPO

Industry News | 2011-03-31 12:07:21.0

JBC Tools announces that it will exhibit in Booth #2629 at the upcoming IPC APEX EXPO.

JBC Tools USA, Inc

JBC Tools Inc. to Exhibit at the SMTA Oregon Symposium and Supplier Day

Industry News | 2011-05-16 15:56:59.0

JBC Tools announces that it will exhibit at the upcoming SMTA Oregon Symposium and Supplier Day, scheduled to take place Wednesday, May 18, 2011 at the Tektronix Building 38 Conference Center in Beaverton, OR.

JBC Tools USA, Inc

JBC Tools Inc. to Exhibit at IPC Midwest 2011

Industry News | 2011-08-22 18:36:29.0

JBC Tools will feature its Nano Station in Booth #226 at the upcoming IPC Midwest Conference & Exhibition.

JBC Tools USA, Inc


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