Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2003-04-11 07:58:27.0
IPC reports that 3,600 attendees gathered in Anaheim, Calif., for IPC SMEMA Council�s APEX�
Industry News | 2010-09-22 15:01:40.0
Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.
Industry News | 2018-06-06 20:24:14.0
ITW EAE partner ProSMT has just installed their first MPM printer in Turkey. This is a major market for electronics manufacturing equipment and this is the first step toward further sales growth in the area. ProSMT represents world-class products from ITW EAE including MPM printers, Camelot dispensers, Vitronics Soltec wave, reflow and selective equipment, plus Electrovert soldering solutions and cleaners.
Industry News | 2023-08-29 07:14:08.0
Pro-Active Engineering, a well-known leader in the PCB industry for over 26 years who guide customers through the complexities of design engineering, has chosen Pillarhouse International as their selective soldering process equipment provider and purchased an Orissa Fusion as part of their efforts to increase U.S. market share.
Industry News | 2015-09-22 11:52:54.0
PennEngineering® has been awarded U.S. Patent No. 9,113,567 for a unique three-piece heat sink mounting system designed to securely attach heat sinks to printed circuit boards while providing firm and constant contact to the chip component for optimized heat dissipation. The inventor of this dynamic mounting system is Robert F. Stotz, Jr.
Industry News | 2022-03-09 12:37:18.0
Pin and Slant Fin Heat Sinks Offer Economical Electronics Cooling
Industry News | 2012-06-29 08:09:26.0
Aiming to cut assembly costs and avert inverter assembly flaws, several companies now offer power modules that can be mounted in a single step. Some use housings with a hole in the middle and a lid to hold the PCB, module and heat sink in place.
Industry News | 2011-07-28 18:27:19.0
Advanced Thermal Solutions, Inc, (ATS), continues its innovations in electronics thermal management with the BWT-104 Bench Top Wind Tunnel. The BWT-104 is a research quality, open loop wind tunnel for thermally characterizing components, circuit boards and cooling devices such as heat sinks, heat exchangers and cold plates.
Industry News | 2004-10-26 20:19:02.0
Passive Cooling of Intel XEON Processors
