Industry News | 2003-02-24 09:32:24.0
Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.
Industry News | 2018-10-18 08:36:26.0
How the modern solder reflow oven works?
Industry News | 2018-10-18 08:42:00.0
Reflow oven zone temperature set up and thermal profile
Industry News | 2018-10-18 09:14:05.0
Lead-free processes propose new requirements on reflow soldering quality
Industry News | 2012-08-09 18:20:49.0
The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on August 23, 2012 from 9:00 am until 3:00 pm.
Industry News | 2024-10-06 08:00:38.0
In the world of electronics manufacturing, soldering plays a critical role. The PCB reflow oven process has revolutionized the industry by improving the quality of solder joints, especially for high-reliability applications like aerospace, automotive, and medical devices. But what exactly is this process, and why should manufacturers consider it?
Industry News | 2010-10-06 14:44:35.0
Helping electronics manufacturing companies train their staff to enhance product quality and increase efficiency, IPC — Association Connecting Electronics Industries® has released a new educational video, DVD-18C, Soldering Terminals. The 37-minute video covers industry best practices for soldering wires to commonly used terminals in accordance with the latest IPC-A-610E and J-STD-001E acceptance standards.
Industry News | 2020-01-29 07:33:26.0
IPC announces the winners of the IPC APEX EXPO 2020 Innovation Awards, a celebration of the innovators who are changing the technological landscape of the electronics industry.
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
