Industry News | 2003-03-11 21:51:18.0
New release compares netlists to identify test points moved, added, deleted, renamed or re-assigned in Excel and HTML reports.
Industry News | 2004-07-08 11:05:15.0
Utah Manufacturer and Systems Integrator of Embedded Computer Products Maintains Globally Recognized ISO Certification for Quality
Industry News | 2009-06-12 13:56:24.0
Orchid Technologies featured in COTS Journal
Industry News | 2009-06-23 20:26:31.0
Debuting its most recent technology advance, mass imaging leader DEK will showcase the company’s new thin wafer processing expertise from booth #811 at the upcoming Semicon West event in San Francisco, California. A full line solution that incorporates a Galaxy Thin Wafer System and a next-generation CHAD WaferMate™ wafer handler, this latest development resolves traditional challenges associated with high-speed handling and processing of thinned wafers on a proven print platform.
Industry News | 2010-02-15 19:32:28.0
Rosenheim, Germany — February 2010 — Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Valts Treibergs and Chris Cuda will present a paper titled “Spring Probe PCB Pad Wear Analysis” at the upcoming Burn-in & Test Socket Workshop, schedule to take place March 7-10, 2010 at the Hilton Phoenix East/Mesa Hotel in Mesa, Ariz.
Industry News | 2011-05-06 20:51:40.0
Data I/O Corporation announces the purchase of software technology in the form of source code, patents and other intellectual property for approximately $3 million through a combination of cash and equity.
Industry News | 2018-02-28 05:58:59.0
Cogiscan Inc.has signed an OEM reselling agreement with Universal Instruments to expand their portfolio of manufacturing solutions. Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry.
Industry News | 2018-10-15 18:31:07.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2018-10-18 19:55:33.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2018-11-06 20:35:12.0
Kurtz Ersa today announced that Krypton Solutions LLC has invested in several new systems from Ersa for its new facility. A long-time Ersa customer with equipment at its Plano, TX facility, Krypton selected Ersa to help furnish its new facility in San Jose, CA.
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