Industry News: heatsink for to-252 (Page 1 of 1)

Long Life for Heatsink Thermal Tape

Industry News | 2003-07-02 08:54:26.0

A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.

SMTnet

Easier Dispensing for Thermal Sealant

Industry News | 2003-02-24 09:32:24.0

Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.

SMTnet

Parvus to Unveil Military-Grade, Galvanically Isolated Power Supply for Embedded Computer Systems

Industry News | 2005-06-08 12:34:26.0

New OnPower 60-I PC/104 Power Supply to Deliver 60 Watts over Extended Temperature Range (-40 to +85C)

Parvus Corporation

TopLine® Awarded US Patent for CCGA Lead Free Solder Columns

Industry News | 2021-04-01 08:18:33.0

TopLine Corporation has been granted US patent 10,937,752 for Lead Free Solder Columns for Column Grid Array Substrates. TopLine holds 7 patents in the field of Column Grid Arrays, also known as CCGA.

TopLine Dummy Components

Thermal Management Material Specification for LED PCB Design, Assembly & Fabrication

Industry News | 2009-08-11 10:17:35.0

Saturn Electronics Corporation, minority-owned bare printed circuit board fabrication manufacturer, announced a new webinar addressing PCB material specifications pertaining to thermal management for LED Boards

Saturn Electronics Corporation

Parvus Unveils Three Fanless 800MHz Pentium III PC/104-Plus CPU Modules Designed for -40C to +85C Extended Temperature

Industry News | 2005-07-11 12:52:53.0

Parvus now offers low-power Intel Pentium III-based architecture in three new ruggedized PC/104-Plus CPU boards, the SpacePC 1460, 1461 and 1463

Parvus Corporation

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