Industry News | 2022-06-16 17:54:09.0
Heraeus Electronics today announced that it will hold a free WelcoTM LED Solder Paste Webinar on Thursday, June 9, 2022 at 3 a.m. EDT. The new webinar is entitled, "Enabling Mini and Micro LED using Heraeus Electronics LED series solder paste."
Industry News | 2022-05-05 17:06:12.0
Heraeus Electronics today announced that Susanne Klaudia Duch, Project Leader Development - Copper Sinter Paste, and Dennis Ang, Global Product Manager - Die Attach and Sinter Products, Heraeus Electronics, will present during the E-Mobility Forum at PCIM Europe. The presentation entitled, "How Near is Copper Sintering?" is scheduled to take place May 10, 2022 at 11:20 a.m.
Industry News | 2022-04-28 15:05:22.0
In times of climate change and increases in energy use, the demands of power modules for the efficient and reliable control of electric motors continue to rise. Modern module concepts are reaching their limits in terms of power density, current carrying capacity, and reliability to increase lifetime and reduce costs. A critical area for improving power modules is the material system used in them, as well as their electrical and thermal interconnection.
Industry News | 2022-04-13 10:29:39.0
Heraeus Electronics today announced plans to exhibit in Hall 6, Booth 322 at PCIM Europe, the leading conference and exhibition for power electronics, renewable energy and energy management. The event is scheduled to take place May 10-12, 2022 in Nuremberg. In parallel to PCIM Europe, SMTconnect will take place in halls 4, 4A and 5.
Industry News | 2022-05-18 13:01:33.0
Heraeus Electronics today announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg. This innovative optimized copper ribbon is proven to effectively achieve more efficiency and stability in power electronic systems. It enables module operation temperatures higher than 250°C and allows the highest power density designs.
Industry News | 2022-05-18 12:32:37.0
Heraeus Electronics today announced the launch of its new Condura®.ultra Ag free AMB Substrate. A cost-efficient, highly reliable, Ag free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils, Condura®.ultra was developed using a special technique enabling high-performance Si3N4 substrates by using new, Ag free active metal brazing (AMB) bonding technology.
Industry News | 2022-05-18 12:37:13.0
Heraeus Electronics today announced that Bastian Schlüter, Global Product Manager Metal Ceramic Substrates, will present during the E-Mobility Forum at PCIM Europe. The presentation entitled, "Al2O3, ZTA, AMB and What's Next?" is scheduled to take place May 11, 2022 at 12:50 p.m.
Industry News | 2022-12-07 08:05:39.0
Heraeus Electronics celebrated the 2nd anniversary of its Center of Excellence for Advanced Packaging in Singapore with a customer event.
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