Industry News | 2013-07-19 11:27:23.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 10th Annual International Wafer-Level Packaging Conference.
Industry News | 2014-06-10 14:14:42.0
Call for Smart Reforms in Economic, Environmental and National Security Policies
Industry News | 2014-07-01 13:09:02.0
IPC — Association Connecting Electronics Industries® today co-hosted congressional visits to Optimum Design Associates (ODA) and JPS Industries Inc. as part of its nationwide effort to educate members of Congress about legislative and regulatory issues that impact the electronics manufacturing industry.
Industry News | 2020-01-08 16:51:58.0
The SMTA Capital Chapter is excited to host a Chapter Meeting on February 20th from 5:00 PM to 7:30 PM at PACE Worldwide in Elkridge, MD. Jason Fullerton, MacDermid Alpha Electronic Solutions, will be presenting “Advances in Lead-Free Solder Technologies for High Reliability Applications.”
Industry News | 2020-08-07 07:29:43.0
The SMTA Capital Chapter is excited to host its first FREE webinar on Wednesday, August 19th. The webinar will include an informative presentation given by industry expert Norman Armendariz, Ph.D. of Raytheon Company on "DfR- Design for Rinse-ability: Effect of SMT Component Package Design on Cleaning Effectiveness."
Industry News | 2018-05-06 18:10:24.0
The SMTA Capital Chapter is excited to host a Chapter Meeting on May 15th from 5:00PM to 7:30PM at EIT, Leesburg, VA. IPC-Association Connecting Electronics Industries® has released the G revisions of the two most widely used standards in the electronic industry and who better to present “What’s New in IPC J-STD-001G and IPC-A-610G” than William Graver, Senior Analyst and Master IPC Trainer.
Industry News | 2021-03-06 03:08:24.0
In a letter to U.S. President Joe Biden, IPC applauds the Biden administration's early directions on manufacturing policy and maps a detailed policy agenda to drive growth and resilience in electronics manufacturing.
Industry News | 2021-03-25 15:48:41.0
The SMTA Officer team is excited to provide our members with a new webinar by Dr. Nathan Blattau, R&D Fellow at Ansys, Inc., on "Next Generation Lead Free Solders for High Reliability and SMT Yield improvement in Client Computing Systems." The webinar will be on Tuesday, April 6th at 12:00 PM EST and will discuss the evolution of lead free (Pb-free) solder, from tin-silver-copper (SAC) system with silver content of 3.0 and 4.0 to low SAC solders and the emergence of high reliability Pb-free solder. It will cover the reasons and the driving forces of industries implementing this change.
