Industry News: hf and 27 (Page 8 of 39)

Issues Impeding U.S. Electronics Manufacturers’ Competitiveness Given Platform for Change at IPC Summit and Capitol Hill Day

Industry News | 2011-05-27 23:00:33.0

Government over-regulation, export controls and maintaining the military and aerospace sectors’ use of U.S. electronic interconnect manufacturing capacity are just some of the key issues that will be addressed at the IPC Summit on American Competitiveness and Capitol Hill Day, June 15-16, 2011, in Washington, D.C.

Association Connecting Electronics Industries (IPC)

The Smart Factory is Becoming a Reality as IPC APEX EXPO 2019 Hosts Two Live Production Lines Collaboration between IPC CFX and HERMES Standards to be highlighted

Industry News | 2018-12-11 19:12:27.0

Creating the next generation of digital Industry 4.0 technology standards, IPC will again take a major step forward at IPC APEX EXPO 2019, featuring two live production lines, at which visitors can see and experience achievements made in digital standards development over the past year.

Association Connecting Electronics Industries (IPC)

MN Solder and IPC Certifications-BEST Inc

Industry News | 2010-09-03 17:14:32.0

BEST Inc Joins Force with Dakota County Technical College

BEST Inc.

Koh Young Sharing its Inspection Perspective on EV Testing Applications and Standards during a Webinar on 27 September 2022

Industry News | 2022-09-21 08:15:06.0

Koh Young Technology will share its perspective on test standards, systems, and criteria for electronic vehicle (EV) applications in a panel webinar on 27 September 2022 at 10:30am EST

Koh Young America, Inc.

FCT Develops Versatile Water Soluble Flux for Leaded and Lead-Free Soldering

Industry News | 2016-03-30 08:19:13.0

FCT Assembly has formulated a unique halogen-free water soluble flux with high activity and neutral pH. FCT's 159HF is a highly versatile solder flux formulated to perform under high temperatures and is compatible with both leaded and lead free alloys. With the low solids content of 159HF, the water soluble flux is applicable in selective; drop-jet spray soldering applications while also being ideal for wave soldering. Because the flux stays active under critical temperatures during pre-heat and wave, 159HF performs exceptionally well in high temperature applications, especially with manufacturers using multilayer boards with lots of heat sink resulting in improved topside fill.

FCT ASSEMBLY, INC.

FCT Develops Versatile Water Soluble Flux for Leaded and Lead-Free Soldering

Industry News | 2016-03-29 13:24:40.0

FCT Assembly (www.fctassembly.com), a leader in the development and manufacturing of high performance solders and advanced fluxes; has formulated a unique halogen-free water soluble flux with high activity and neutral pH. FCT’s 159HF is a highly versatile solder flux formulated to perform under high temperatures and is compatible with both leaded and lead free alloys.

FCT ASSEMBLY, INC.

At the NI Week Conference in Austin Seica Will Debut the Pilot4D V8 HF, a Unique Solution Combining Flying Probe Technology and High Frequency Testing.

Industry News | 2016-08-02 15:20:43.0

Seica will make take advantage of its debut at the annual NI Week conference in Austin (1-4 August 2016) for the world premiere of the Pilot4D V8 HF, a unique solution combining flying probe technology and High Frequency testing. Seica will also be showing another combinational test configuration, the MINI80 in a PXI rack, in booth 833 in the Main Exhibition Hall.

SEICA SpA

Indium Corporation Features Void-Reducing Solder Paste Indium8.9HF at Productronica

Industry News | 2015-10-27 22:08:05.0

Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste, at Productronica 2015, Nov. 10-13, in Munich, Germany.

Indium Corporation

New Henkel Electrically Conductive Adhesive Cures Fast at Low Temperature; Ideal for Photovoltaic, Automotive and Membrane Switch Applications

Industry News | 2010-05-12 13:12:33.0

Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.

Henkel Electronic Materials


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