Industry News | 2016-04-17 21:30:50.0
MIRTEC, “The Global Leader in Inspection Technology,” announced that MIRTEC Europe had a record breaking first quarter and has high expectations for the months to come. Also, MIRTEC will display its award-winning 3D AOI and SPI Inspection Systems in pc tec’s booth, Hall 7A, Stand 504, at the upcoming SMT/Hybrid/Packaging show, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.
Industry News | 2016-11-14 20:04:34.0
MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that SMT Hautes Technologies, has selected MIRTEC’s award winning MV-7 OMNI as their future 3D AOI platform of choice.
Industry News | 2019-01-17 20:36:59.0
MIRTEC, ‘The Global Leader in Inspection Technology’, is pleased to announce the appointment of Kirby & Demarest as its manufacturers’ representative. Kirby & Demarest will provide sales and support for MIRTEC’s award-winning inspection systems in Oregon, Washington, Idaho, Montana and the Province of British Columbia. The rep firm provides high technology companies an array of products utilized in the design, manufacturer and test of circuit board assemblies, hybrid circuits, and semiconductors.
Industry News | 2020-06-29 15:57:08.0
MIRTEC is pleased to announce that VIRTEX has selected MIRTEC as its AOI business partner. MIRTEC's Award-Winning MV-6 OMNI is the ideal 3D Inspection Solution to meet the stringent quality requirements of VIRTEX's high-reliability customers.
Industry News | 2022-09-26 07:14:47.0
MIRTEC, "The Global Leader in Inspection Technology," received a 2022 Mexico Technology Award in the category of Inspection – AOI for its all-new GENESYS-PIN 3D AOI System. The award was announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico.
Industry News | 2003-02-13 07:53:53.0
Belgian Laminate Plant Set to Come Online
Industry News | 2003-02-20 08:04:10.0
The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.
Industry News | 2003-02-24 09:47:35.0
Mark R. Hollinger, Chairman and CEO, will present at the Raymond James 24th Annual Institutional Investors Conference at 2:40 p.m. ET on Tuesday, March 4th.
Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Industry News | 2003-03-24 09:38:49.0
Declared a regular quarterly dividend of $0.06 per share payable May 6, 2003 to stockholders of record at the close of business on April 8, 2003.
