Industry News | 2003-06-25 12:40:26.0
to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks
Industry News | 2003-04-14 08:50:52.0
Providing connection facilities for PCBs designed to be used in hazardous areas is straightforward with Phoenix Contact's new range of Combicon Ex-approved printed circuit terminal blocks.
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2003-02-06 08:28:24.0
Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2
Industry News | 2003-07-02 09:35:30.0
As a result, sales of optical MEMS, into segments other than telecommunications, are forecast to grow at a CAGR of 15.8% over the next five years.
Industry News | 2018-10-18 10:18:58.0
Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?
Industry News | 2012-11-27 15:24:14.0
IPC’s National Conference on Electronics Design, Assembly and Reliability (NCEDAR), to be held December 4–6, 2012, at the Indian Institute of Science in Bangalore, India, will provide information on state-of-the-art technologies in printed circuit board design and manufacturing.
Industry News | 2015-04-23 16:30:38.0
Metcal is pleased to announce that SMTA China awarded its Applications Manager, Paul Wood, ‘The Best Presentation of Vendor Conference One’ for the presentation titled “Why Non-Contact Array Solder Clean Up is required.” The award was presented during the SMTA China East 2015 Conference Award Presentation Ceremony on April 22, 2015 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2020-06-24 15:45:07.0
IPC and High Density Package Users Group (HDP) have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.
