Industry News: high density interconnet (Page 1 of 83)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Deep Micro-vias Available on Large-format PCBs

Industry News | 2003-02-25 08:18:29.0

Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.

SMTnet

Virtex-II FPGA Prototyping Boards Enable Complex FPGA Design Evaluation & Testing

Industry News | 2003-06-16 09:12:35.0

Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces

SMTnet

More Capacity for Compact Electrolytics

Industry News | 2003-03-20 08:12:57.0

Nichicon has increased the top capacitance value of its WG series of surface mount electrolytic capacitors from 1000 to 1500uF.

SMTnet

Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet

Flatpack Relay Handles Heavy Currents Onboard

Industry News | 2003-06-20 08:18:46.0

Providing the ideal solution to high-current PCB applications where height restrictions are a major consideration is Finder's 40.11 series flatpack PCB relay.

SMTnet

MIRTEC Wins $15M Contract with Leading Mobile solution Providers

Industry News | 2009-07-12 14:19:25.0

Seoul Korea — July 2009 — MIRTEC, “The Global Leader in Inspection Technology,” announces that the company has been awarded contracts totaling more than $15M with leading mobile solution manufacturers for its MV-7xi inline automated optical inspection (AOI) systems.

MIRTEC Corp

Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

SMTnet

Circuit World Announces License of Channel Routing Technology from Nortel Networks

Industry News | 2003-06-25 12:40:26.0

to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks

SMTnet

Power Connectors Bring Heavy Cables Onboard

Industry News | 2003-05-23 08:24:49.0

Solid cables of up to 35mm2 cross-section now can be connected to PCBs easily, reliably and cost-effectively with the new Power Combicon range of connectors.

SMTnet

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