Industry News | 2017-01-11 18:22:38.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #3101 at the 2017 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 14-16, 2017 at the San Diego Convention Center.
Industry News | 2003-06-12 08:48:13.0
Richardson Electronics named first worldwide distributor
Industry News | 2013-12-05 16:48:11.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it has been selected as a finalist for the 2014 Best in Test Awards in the Machine Vision/Inspection category for its MV-9 2D/3D CoaXPress In-Line AOI Series. Since 1991, the Best in Test Awards have recognized the best in test products and test professionals.
Industry News | 2017-04-22 12:38:58.0
MIRTEC, “The Global Leader in Inspection Technology,” today announced they will display their award-winning 3D AOI and SPI Inspection Systems in pb tec’s booth, in Hall 4A, Stand 140 at the upcoming SMT/Hybrid/Packaging Show, scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.
Industry News | 2013-04-25 11:34:59.0
MIRTEC, announces that it has been awarded a 2013 EM Asia Innovation Award in the category of Test & Measurement/Inspection Systems – AOI for its MV-9 2D/3D CoaXPress In-Line AOI Series.
Industry News | 2016-11-01 19:52:12.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that CALTRONICS Design & Assembly, Inc., a PCB Manufacturing and Electronic Design Company, purchased an award-winning MV-6 OMNI 3D AOI Machine during SMTA International in Rosemont, IL.
Industry News | 2021-01-10 05:22:47.0
MIRTEC announce that European Circuits Limited purchased an MV-3 OMNI Desktop 3D AOI Machine. The purchase was facilitated through Bentec Ltd.
Industry News | 2023-11-13 12:28:17.0
MIRTEC announces the development of groundbreaking inspection technologies that it will unveil at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. The new systems address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations, offering manufacturers the perfect solution for enhanced quality and productivity.
Industry News | 2003-05-21 09:03:19.0
Cadence Design and Analysis Solution Used for Asus's Ultra-high-frequency PCB Designs
Industry News | 2021-12-21 14:45:26.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1122 at the 2022 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place January 25-27, 2022, at the San Diego Convention Center.