Industry News: high pitch (Page 1 of 65)

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

Terminal Blocks Handle the Hazards

Industry News | 2003-04-14 08:50:52.0

Providing connection facilities for PCBs designed to be used in hazardous areas is straightforward with Phoenix Contact's new range of Combicon Ex-approved printed circuit terminal blocks.

SMTnet

Connectors Handle Up to 54A Safely Onboard

Industry News | 2003-05-19 08:44:19.0

Two new PCB power connectors offer easy high power wiring (up to 54A) with built-in safety features to prevent incorrect connections and resist strong vibration.

SMTnet

Cable Jumpers Provide Flexible Connections

Industry News | 2003-05-02 08:01:53.0

Flexstrip cable jumpers provide multiconductor board-to-board connection without wire stripping, cutting to length or solder preparation.

SMTnet

Wire-to-board Range Handles Up To 16A

Industry News | 2003-05-12 09:19:51.0

No larger than conventional 12A wire-to-board connectors for PCB applications

SMTnet

Evaluation Kit for Novel Board-to-board Jumpers

Industry News | 2003-03-04 08:08:23.0

In a move that broadens its interconnect design services, Micromark C and CD has introduced a new development kit for the Flexstrip jumpers flexible interconnect system.

SMTnet

Power Connectors Bring Heavy Cables Onboard

Industry News | 2003-05-23 08:24:49.0

Solid cables of up to 35mm2 cross-section now can be connected to PCBs easily, reliably and cost-effectively with the new Power Combicon range of connectors.

SMTnet

Introbotics Announces New Board Testing Capability for Merix Corporation

Industry News | 2003-04-01 08:13:08.0

The Introbotics equipment boosts controlled impedance testing productivity and accuracy by a factor of ten compared to the handheld probing techniques.

SMTnet

Nordson ASYMTEK's Dual-Simultaneous Programmable Pitch Cuts Conformal Coating Time in Half

Industry News | 2016-09-15 18:27:44.0

Motorized design takes guess-work out of repositioning applicators during printed circuit board assembly and electronics manufacturing.

ASYMTEK Products | Nordson Electronics Solutions

IPC’s Revised BGA Guideline Features Expanded Focus on Mechanical Reliability

Industry News | 2013-01-30 17:54:43.0

Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.

Association Connecting Electronics Industries (IPC)

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