Industry News | 2013-02-20 21:19:21.0
Speedprint Technology announces that it has been awarded a 2013 NPI Award in the category of Screen/Stencil Printing for its SP710avi with Advanced Dispense Unit
Industry News | 2016-03-07 14:00:21.0
Mycronic is expanding the capabilities of its highly versatile MY600 solder paste jet printing platform. At IPC APEX EXPO 2016 the company will demonstrate new high-speed and high-precision jet dispensing capabilities for the MY600, making it the fastest dispensing platform on the market.
Industry News | 2019-11-04 15:52:59.0
Techcon plans to exhibit in Hall A2, Booth 135 at productronica, scheduled to take place Nov. 12-15, 2019 at the Neue Messe München in Munich, Germany. The company will showcase its new TS9800 Series Jet Valve Dispensing System, TS8100 Series Progressive Cavity Pump and TSR2000 Smart Dispensing Robots.
Industry News | 2017-06-05 15:45:06.0
YINCAE has developed a new innovative solder joint encapsulant paste. Designed to be used for mass production via dispensing or printing, SMT 256EP replaces traditional solder paste, flux, and underfill. SMT 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280°C).
Industry News | 2012-06-26 14:04:28.0
Techcon Systems today announced the addition of 32-pitch TS7000 model to the TS7000 Valve Series.
Industry News | 2013-12-18 08:20:08.0
Building electronic solutions using LEDs brings significant advantages regarding flexibility in design and time-to-market. Building such products, however, requires expansive knowhow and high-quality equipment for all steps from circuit design to assembly and testing. The UK company SafeTest Ltd. has all required experience, knowledge and equipment under one roof. Assembly machines from Essemtec Switzerland enable SafeTest to quickly realize customer-specific LED applications of highest Quality.
Industry News | 2013-10-08 16:27:28.0
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will highlight its newest machines in Hall A3, Stand 341 at the 20th international productronica international trade fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2013-09-13 13:47:27.0
Speedprint Technology will exhibit the SP710avi with Advanced Dispense Unit in Booth #815 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
Industry News | 2013-10-04 19:00:18.0
Speedprint Technology will highlight the SP710avi with Advanced Dispense Unit at the Long Island SMTA Expo & Technical Forum, scheduled to take place Wednesday, October 9, 2013 at the Islandia Marriott Long Island in New York.
Industry News | 2012-09-21 17:35:47.0
Speedprint Technology will exhibit at the upcoming Long Island SMTA Expo and Technical Forum
