Industry News: high speed glue dispenser (Page 18 of 54)

Creative Automation Introduces Solutions for Biomedical Applications

Industry News | 2008-01-23 10:17:05.0

SUN VALLEY, CA � January 17, 2008 � Creative Automation Company announces new solutions for automation and dispensing for today�s biomedical industry.

Creative Automation Company

Get on Board with Nordson ASYMTEK at IPC APEX Expo Booth 2125

Industry News | 2019-01-08 20:43:11.0

Nordson ASYMTEK will be demonstrating large-volume and advanced dispensing, hot bar soldering, and a conformal coating line at IPC APEX, San Diego, CA from January 29-31, 2019, at booth 2125.Also featured will be a range of jets and valves for dispensing and coating applications, including the award-winning SC-350 Select Spray Applicator.

3M Electrical Solutions Division

Nordson EFD Features Three New Dispensing Systems at The Assembly Show, Booth #823

Industry News | 2015-10-18 20:18:26.0

Nordson EFD will introduce its third new series of dispensing valves at The Assembly Show, October 27-29, 2015 at the Donald E. Stephens Convention Center, Rosemont, IL, at booth 823. The new series will join the recently introduced PICO® Pµlse™ valve and PICO Toµch™ controller and xQR41 MicroDot™ mini-needle valve. Nordson EFD's latest automated closed-loop dispensing system with vision and laser height sensing, the PRO Series, will also be on display.

Nordson EFD

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Industry News | 2016-04-07 09:09:16.0

Finetech/Martin will showcase three new dispense products and a new version of the Mini-Oven BGA/CSP reballing unit in Booth #1259 at the upcoming IPC APEX Conference scheduled for March 15-17, 2016 at the Las Vegas Convention Center.

Finetech

Jet printing at 700,000 dots per hour challenges solder paste dispensing

Industry News | 2013-11-15 17:04:20.0

The popularity of jet printing technology to apply solder paste to printed circuit boards is growing fast as more and more electronics manufacturers understand the key advantages over traditional methods of solder paste application, such as screen printing or dispensing. Today hundreds of electronic producers worldwide are using jet printing for a diverse range of applications – situations that demand speed, design freedom and high-quality solder joints.

Mycronic Technologies AB

Henkel Chipbonder Compatible with Non-Contact Dispensing Technology; Enables Higher Throughput and More Uniform Dot Dimensions

Industry News | 2012-04-04 15:31:23.0

Known worldwide for surface-mount adhesive (SMA) development leadership, Henkel has set the industry benchmark with its high-performance Chipbonder brand adhesives. Within the company’s expansive portfolio of SMAs is

Henkel Electronic Materials

Fuji Releases the DynaHead (HX) and HexaFeeder

Industry News | 2013-10-01 04:27:08.0

Fuji Machine Manufacturing Co., Ltd. is proud to announce the release of the DynaHead (HX) and HexaFeeder for our electronic component mounting machines (placing machines). DynaHeads are supported on AIMEX II and AIMEX IIS machines. HexaFeeders are supported on NXT II, NXT III machines as well as AIMEX-series machines.

FUJI CORPORATION

Achieve Higher Productivity at a Lower Cost with Anda’s In-Line AP-460 Atmospheric Plasma Cleaning Machine

Industry News | 2018-03-29 07:09:21.0

Anda Technologies USA removes all impurities and contaminants (including dust, grease and dirt, as well as static electricity), improving surface area adhesion.

Anda Automation Pte Ltd

Nordson DIMA to Demonstrate Hot Bar Reflow Soldering and Automated Flux Dispensing with the C-TurnFlux System at IPC APEX Expo 2019

Industry News | 2019-01-16 09:48:30.0

Nordson DIMA will exhibit its C-TurnFlux system, the automated stand-alone hot bar system that combines flux dispensing with hot bar reflow soldering, at the IPC APEX Expo, San Diego, CA - its first live demonstration in North America. The C-TurnFlux combines both high output and quality, using high-speed product handling and guaranteed position repeatability for mission-critical assembly applications.

C-Tech Systems, B.V. [formerly Nordson DIMA]

VERMES Microdispensing introduces its Multi Micro Dispensing System for low and medium viscosity

Industry News | 2016-07-12 04:51:50.0

The all-new Multi Micro Dispensing System (Multi MDS) is architected for independent and simultaneous four-valve multi dispensing. It simplifies and reduces dispense valve setup and operation time

VERMES Microdispensing GmbH


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