Industry News: high speed glue dispenser (Page 9 of 54)

ESSEMTEC to Highlight a Range of Leading-Edge Technologies at SMT Hybrid Packaging 2013

Industry News | 2013-04-10 11:48:47.0

Essemtec, announces that it will exhibit numerous flexible Swiss-made solutions in Booth 7, Hall 211 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

ESSEMTEC AG

Specialty Coating Systems to Exhibit Multi-Valve Technologies at The ASSEMBLY Show

Industry News | 2019-10-15 15:08:32.0

Specialty Coating Systems has announced plans to return to The ASSEMBLY Show, scheduled to take place Oct. 22-24, 2019, at the Donald E. Stephens Convention Center in Rosemont, IL. The company will provide demonstrations in Booth #1818 of its PrecisionCoat V with the highly flexible Automatic Quick Change (AQC) feature that allows for the use of multiple tools within a single machine/coating profile. Additionally, SCS will highlight the PrecisionCoat’s dispensing capabilities.

Specialty Coating Systems

Essemtec Wins the 2017 NPI Award for Multifunction Placement for the New FOX2

Industry News | 2017-02-21 15:59:49.0

Essemtec announces that it has been awarded a 2017 NPI Award in the category of Component Placement – Multifunction for its FOX2. The award was presented to the company during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. This marks the 15th industry award that the Swiss manufacturer has received in recognition of its production systems for electronic assembly and packaging. The new FOX2 by Essemtec combines jetting of solder paste or glue and placement in a single machine. The new version is based on the original award-winning platform, which is the first machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments.

ESSEMTEC AG

Essemtec’s Technology Day to Highlight Future Dispensing and MID Technologies

Industry News | 2012-11-06 11:22:15.0

Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.

ESSEMTEC AG

Introducing - The Fox Pack – State-of-the-art Expandable Placement and Dispensing from Essemtec

Industry News | 2020-04-23 11:07:52.0

Essemtec announces that its FOX2 smart-sized modular pick-and-place technology is expandable in any direction. The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.

ESSEMTEC AG

Essemtec is exhibiting at APEX Expo at booth 2409.

Industry News | 2024-03-18 11:39:20.0

We are showcasing our flagship All-in-One platforms FOX and PUMA. The machines will be equipped with the latest innovations in Solder Jetting, Integrated Inspection System, Smart Material Management, and 4 mm EVO feeder – 08004 Pick-and-Place.

ESSEMTEC AG

Essemtec Receives 2019 Mexico Technology Award for Multi-function Component Placement

Industry News | 2019-10-24 16:14:40.0

Essemtec announces that it was awarded a 2019 Mexico Technology Award in the category of Component Placement – Multi-function for its FOX2. The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum. The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.

ESSEMTEC AG

Essemtec Highlights SMT Highly Versatile Production on a High-Quality Level at Electronica India 2011

Industry News | 2011-08-29 16:18:01.0

Essemtec will exhibit a Swiss Made, highly flexible SMD assembly line at the upcoming electronica India 2011. The promoted turnkey line consist of a SP150-SV-PLUS high accuracy solder paste printer, a PANTERA-XV highly flexible SMD pick-and-place and a RO400-FC full convection reflow oven.

ESSEMTEC AG

ASYS Group unveils new Printer Platform and new technologies at IPC APEX

Industry News | 2014-02-14 22:45:00.0

ASYS Group is proud to announce the all new SERIO 4000 Printer Platform from EKRA, as well as the revolutionary PULSE Mobile Line Assistant interface for ASYS Handling and Process machines.

ASYS Group

World’s First SMT Assembler with Integrated Solder Paste Jet Printer at SMTAI

Industry News | 2014-08-27 21:41:51.0

Essemtec announces that it will highlight the Paraquda 2 with integrated solder paste jet printer in Booth #640 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

ESSEMTEC AG


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