Industry News: high-density packaging (Page 1 of 23)

Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet

Virtex-II FPGA Prototyping Boards Enable Complex FPGA Design Evaluation & Testing

Industry News | 2003-06-16 09:12:35.0

Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces

SMTnet

Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

SMTnet

MIRTEC Wins $15M Contract with Leading Mobile solution Providers

Industry News | 2009-07-12 14:19:25.0

Seoul Korea — July 2009 — MIRTEC, “The Global Leader in Inspection Technology,” announces that the company has been awarded contracts totaling more than $15M with leading mobile solution manufacturers for its MV-7xi inline automated optical inspection (AOI) systems.

MIRTEC Corp

Low-Cost UNIX- and PC-Based Boundary-Scan Upgrade for Agilent 3070 In-Circuit Testers

Industry News | 2003-04-03 08:51:07.0

Symphony 3070TM Package from JTAG Technologies for Testing and In-System Flash / PLD Programming

SMTnet

Pulse Offers Highest Power Density SMT Planar Transformer

Industry News | 2003-01-24 09:07:53.0

For Industrial, Telecom and Datacom Use

SMTnet

Circuit World Announces License of Channel Routing Technology from Nortel Networks

Industry News | 2003-06-25 12:40:26.0

to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks

SMTnet

IPC and High Density Package Users Group Sign MoU, Strengthening Collaboration and Value to Membership

Industry News | 2020-06-24 15:45:07.0

IPC and High Density Package Users Group (HDP) have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.

Association Connecting Electronics Industries (IPC)

Virtual Program Announced for International Conference for Electronics Hardware Enabling Technologies (ICEHET)

Industry News | 2021-05-04 11:12:30.0

The SMTA is pleased to announce the International Conference for Electronics Hardware Enabling Technologies (ICEHET) is scheduled 2-3 June 2021 as an express virtual event.

Surface Mount Technology Association (SMTA)

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