Industry News | 2022-05-17 02:13:57.0
High Speed Mini Unloader of Semiconductor High Speed Mini Unloader of leadframe High Speed Mini Unloader of magazine
Industry News | 2024-03-11 18:12:33.0
Hanwha Techwin Automation Americas is pleased to announce that its XM520 High-Speed Dual Lane Chip Mounter has been honored with the 2024 NPI Award in the Component Placement - High-Speed category. Recognized for its best-in-class speed and applicability, the XM520 sets a new standard of flexibility in surface mount technology (SMT) and through-hole technology (THT) production.
Industry News | 2013-05-15 20:24:51.0
At this year's Nepcon Shanghai show the SIPLACE team received two highly influential awards for its new high-end SIPLACE X4i S platform: the EM Innovation Award China, the SMT China Vision Award and the SMT China Prime Product Award. For the fifth time running now, SIPLACE was able to win these prestigious awards, which are given out by independent panels.
Industry News | 2015-11-09 13:17:35.0
Mycronic is again expanding the capabilities of its highly versatile MY600 solder paste jet printing platform. At Productronica 2015 (November 10-13, Munich Trade Fair Center) the company will demonstrate new high-speed and high-precision jet dispensing capabilities for the MY600, making it the fastest dispensing platform on the market.
Industry News | 2023-02-27 18:10:50.0
SHENMAO America, Inc. has released its PF735-PQ10-10L Low Melting Point Lead-Free Solder Paste. The paste has been designed specifically for the SMT process and is applicable to the high-speed printing process to increase production capacity.
Industry News | 2016-03-07 14:00:21.0
Mycronic is expanding the capabilities of its highly versatile MY600 solder paste jet printing platform. At IPC APEX EXPO 2016 the company will demonstrate new high-speed and high-precision jet dispensing capabilities for the MY600, making it the fastest dispensing platform on the market.
Industry News | 2024-05-13 10:19:11.0
SHENMAO Technology is pleased to offer its PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. PF606-P276 has been specifically developed for the surface mount technology (SMT) process, offering superior void performance after the reflow process. By minimizing gas generation during reflow, this solder paste ensures exceptional reliability and performance for a wide range of electronic components and assemblies.
Industry News | 2007-11-15 19:53:20.0
LIVERMORE, Calif.--(BUSINESS WIRE)--Nov. 15, 2007--Adept Technology, Inc. (NASDAQ:ADEP), the leading provider of intelligent vision-guided robotics and global robotics services, announced today that it has received a $5.0M order for Adept Quattro(TM) robots from a major European machine builder.
Industry News | 2012-02-10 16:30:05.0
Everett Charles Technologies’ (ECT) Contact Solutions will highlight the ZIP® family at the upcoming Burn-In & Test Strategies Workshop.
Industry News | 2012-08-08 17:26:00.0
Everett Charles Technologies’ (ECT) announces that it will highlight the new HyperCore Base Material
