Industry News | 2010-06-28 19:23:30.0
PFC Flexible Circuits Qualifies New, High Speed DuPont™ Pyralux® TK Flexible Circuit Material
Industry News | 2018-01-24 21:20:30.0
Essemtec today announced plans to exhibit in Booth #3525 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company will present a large all-in-one platform that can be used for the assembly of high-speed applications, rapid prototyping and high-speed dispensing. With different modules, the system can grow synchronously with customer requirements for performance and processes. The company also will demonstrate the compact Spider jet dispenser and two FOX² systems – one with the solder paste Jet valve and one with the micro screw valve.
Industry News | 2017-10-16 19:59:28.0
Essemtec will present a large all-in-one platform that can be used for the assembly of high-speed applications, rapid prototyping and high-speed dispensing at productronica 2017. The company will exhibit in Hall A3, Booth 218, Nov. 14 – 17, 2017 at the Messe München in Germany. With different modules, the system can grow synchronously with customer requirements for performance and processes.
Industry News | 2010-12-01 14:13:07.0
Adept Technology introduced a new model of their high-speed parallel style robot, Adept Quattro. The Adept Quattro s800H provides an additional member of the Quattro product family, and expands high-throughput capabilities towards applications with larger work space requirements.
Industry News | 2010-04-12 16:09:04.0
RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.
Industry News | 2010-11-24 15:38:39.0
Adept Technology announced it is exhibiting at the EMBALLAGE show in Paris Nord Villepinte in France from November 22 — 25, 2010. The Adept PAC, featuring the company's high-speed parallel robot, Adept Quattro™ is on display in stand 5a B 087 at the Paris Nord Villepinte Exhibition Centre.
Industry News | 2011-07-13 16:42:46.0
Q Corporation debuts the new Fanuc M-1ia Robot. The M-1ia is a lightweight, compact robot designed for small part handling, high-speed picking and assembly applications.
Industry News | 2008-05-18 01:44:06.0
Adept Cobra s800 Inverted IP65 Robot Brings High Speed Handling to Case and Carton Loading Applications
Industry News | 2022-05-17 02:13:27.0
High Speed Mini Unloader of Semiconductor High Speed Mini Unloader of leadframe High Speed Mini Unloader of magazine
Industry News | 2022-05-17 02:13:47.0
High Speed Mini Unloader of Semiconductor High Speed Mini Unloader of leadframe High Speed Mini Unloader of magazine
