Industry News | 2020-12-29 19:46:07.0
New Ultrafast Rectifiers Feature Unique Combination of Low Conduction and Switching Losses
Industry News | 2020-12-29 19:48:43.0
Ultra Durable Preassembled Power Distribution Equipment offering Single or Multiple Mechanical Interlocks
Industry News | 2021-08-23 20:49:53.0
The compressor is the soul of the whole refrigerator. If the compressor of the refrigerator is faulty, it will lead to the abnormal operation of the refrigerator and affect the cooling effect. If the compressor of the refrigerator is damaged, what is the specific performance? Refrigerator power consumption is relatively large, and what factors are related?
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
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