Industry News | 2017-06-14 10:46:29.0
GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Industry News | 2003-04-17 11:32:31.0
Taking place Sept. 28-Oct. 2, at the Minneapolis Convention Center in Minneapolis, Minn.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2017-05-16 17:59:37.0
PCB Technology Trends 2016, a global study published this month by IPC – Association Connecting Electronics Industries®, is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2021 that will affect the whole industry.
Industry News | 2018-10-18 11:15:12.0
PCB Design and Layout Guidelines
Industry News | 2012-07-25 15:16:14.0
The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference
Industry News | 2011-02-07 15:33:41.0
Multitest announces that Chris Cuda, US Product Manager, will present a paper titled "Benefits & Risks of High Aspect Ratio Vias in ATE Boards" at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, Arizona.
Industry News | 2003-03-11 09:04:04.0
Developed in response to customer requirements, the new Via Fill process from DEK delivers 100% fill of substrate vias with no voids and minimal surface residue.
Industry News | 2020-10-04 15:41:30.0
MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and presenting two technical papers at the IMPACT-EMAP Conference, co-located with TPCA in Taipei, October 21-23, 2020. The papers detail some of the ways in which MacDermid Alpha has invested in the research of innovative manufacturing processes to meet the demanding standards required for the new age of miniaturization.
