Industry News: hot (Page 18 of 63)

Engineered Material Systems to Showcase Liquid and Dry Film Negative Tone Photoresists at MicroTAS

Industry News | 2017-09-13 14:24:45.0

Engineered Material Systems is pleased to announce plans to exhibit at MicroTAS, scheduled to take place Oct. 22-26, 2017 in Savannah, GA. The company will showcase both liquid and dry-film negative photoresists for use in microfluidics, wafer level packaging and CMOS applications (TSV sealing/passivation). These material formulations have been optimized for spin coating (liquid) or hot roll lamination (dry-film) and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Industry News | 2017-10-22 17:38:10.0

Engineered Material Systems is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Industry News | 2017-12-05 14:37:56.0

Engineered Material Systems announces the availability of 5 µm thick dry-film negative photoresists for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll or vacuum lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

EMS Introduces Dry Film Negative Photoresist for Sealing Through-Silicon Vias in CMOS Wafers

Industry News | 2018-03-08 18:44:09.0

Engineered Material Systems is pleased to introduce the availability of its DF-3500 series dry-film negative photoresists for wafer level sealing of through-silicon vias. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

EMS introduces 5 μm thick dry film negative photoresist DF-3505 for metallization processes

Industry News | 2018-09-27 17:08:37.0

Engineered Material Systems, is pleased to introduce the availability of its DF-3505 series dry-film negative photoresists for wafer level metallization processes. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

Croatian Mechatronics Student Wins Europlacer VR Racing Challenge at Productronica.

Industry News | 2019-12-04 14:17:56.0

After four days of hotly-contested competition on the Virtual Reality racing simulator at the Europlacer booth at this year’s Productronica exhibition, the top podium finish went to Jan Pokos, a Croatian student.

EUROPLACER

Weller's Wxsmart Smart Soldering Platform Connects the Future of Soldering

Industry News | 2022-11-15 12:53:39.0

Weller Tools today introduced its new smart soldering platform WXsmart. The platform consists of a 2-channel soldering station and a hot air module with an air and vacuum requirements, from pico to micro and ultra soldering are part of this platform. A calibration unit as well as a soldering tip holder make it a complete platform with which managing your complete soldering process, from tip to station, has never been easier and more productive with the first all-in-one WXsmart hand soldering platform.

Weller/Apex Tool Group

Prices Slashed � Jovy Systems RE-7500 BGA Rework Station

Industry News | 2009-04-02 09:23:02.0

Economic woes � Chinese companies vie for increased sales

AVRepair, Inc.

Weller Launches Five New Rework Systems.

Industry News | 2014-09-15 12:29:23.0

Weller today announced the launch of five new WR3ME Rework Systems. The new systems WR5000M, WR3000TS, WR3000SS, WR3000TA, and WR3000SA, offer application flexibility, productivity and process control, further enhancing the end user experience.

Weller/Apex Tool Group

Techcon Systems to Release the TS9300HM Hot Melt Jet Valve at NEPCON China

Industry News | 2016-03-24 21:18:44.0

Techcon Systems will exhibit in Booth #B-1E52 at NEPCON China, scheduled to take place April 26-28, 2016 at the Shanghai World EXPO Exhibition & Convention Center. Company representatives will debut the new TS9300HM Hot Melt Jet Valve at the show and showcase its lineup of industry-leading valves.

Techcon Systems


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