Industry News: hot (Page 21 of 67)

Weller Launches Five New Rework Systems.

Industry News | 2014-09-15 12:29:23.0

Weller today announced the launch of five new WR3ME Rework Systems. The new systems WR5000M, WR3000TS, WR3000SS, WR3000TA, and WR3000SA, offer application flexibility, productivity and process control, further enhancing the end user experience.

Weller/Apex Tool Group

Techcon Systems to Release the TS9300HM Hot Melt Jet Valve at NEPCON China

Industry News | 2016-03-24 21:18:44.0

Techcon Systems will exhibit in Booth #B-1E52 at NEPCON China, scheduled to take place April 26-28, 2016 at the Shanghai World EXPO Exhibition & Convention Center. Company representatives will debut the new TS9300HM Hot Melt Jet Valve at the show and showcase its lineup of industry-leading valves.

Techcon Systems

Henkel Develops Thermally Conductive Technomelt® Solution

Industry News | 2016-03-30 09:04:09.0

Adding functional capability to its award-winning Technomelt® hot melt encapsulants, Henkel Adhesive Technologies today announced another formulation milestone with the development of a thermally conductive Technomelt material. With the ability to transfer heat through the encapsulating layer, thermally conductive Technomelt products offer dual-function performance in a single material solution.

Henkel Electronic Materials

TECHNOMELT AS 8998 Masking Material Producing Measurable Gains in Efficiency, Cost Control; Recognized with Industry Award

Industry News | 2017-03-06 12:24:15.0

Last month at the IPC APEX Expo event in San Diego, California, Henkel’s TECNOMELT AS 8998 hot melt masking material was presented with a Circuits Assembly NPI award in recognition of its ability to meet several criteria, including: creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, speed/throughput improvements, performance, user-friendliness, and expected maintainability and reparability. The award capped off what has been a successful first year for TECHNOMELT AS 8998, which was commercialized in early 2016 and has already lowered cost and improved operational efficiency at several global electronics manufacturers.

Henkel Electronic Materials

Versatile Dispensing Solutions from Techcon at NEPCON China

Industry News | 2017-03-21 15:05:07.0

Techcon Systems will exhibit in Stand 1H39 at NEPCON China, scheduled to take place April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center. The Techcon team will demonstrate the TS8100 Series Positive Displacement PC Pump, TS9000 Jet Valve, TS9300HM Hot Melt Valve, and TSR2201 Dispensing Robot.

Techcon Systems

Saelig Intros Teledyne LeCroy's quantumdata 280 HDTV A/V Test Set

Industry News | 2018-01-30 14:02:09.0

This small compact, battery powered test set is ideally suited for testing professional A/V and home theatre installations.

Saelig Co. Inc.

Reflow oven zone temperature set up and thermal profile

Industry News | 2018-10-18 08:42:00.0

Reflow oven zone temperature set up and thermal profile

Flason Electronic Co.,limited

Lead-free processes propose new requirements on reflow soldering quality

Industry News | 2018-10-18 09:14:05.0

Lead-free processes propose new requirements on reflow soldering quality

Flason Electronic Co.,limited

Get on Board with Nordson ASYMTEK at IPC APEX Expo Booth 2125

Industry News | 2019-01-08 20:43:11.0

Nordson ASYMTEK will be demonstrating large-volume and advanced dispensing, hot bar soldering, and a conformal coating line at IPC APEX, San Diego, CA from January 29-31, 2019, at booth 2125.Also featured will be a range of jets and valves for dispensing and coating applications, including the award-winning SC-350 Select Spray Applicator.

3M Electrical Solutions Division

Submicron semi-automatic flip eutectic placement machine flip eutectic placement machine

Industry News | 2019-12-16 22:42:05.0

T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.

Beijing Technology Company


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