Industry News | 2017-12-19 19:54:07.0
Indium Corporation will feature Indium11.8HF-SPR Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers – at IPC APEX Expo 2018, Feb. 24-March 1 in San Diego, Calif.
Industry News | 2013-05-01 11:03:43.0
FCT Assembly today announced that it won a major OEM in the Northwest with its NL932 lead-free no-clean solder paste. The OEM evaluated six solder paste suppliers.
Industry News | 2023-03-16 14:42:07.0
SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.
Industry News | 2007-11-01 20:33:22.0
ITASCA, IL � November 1, 2007 � Kester announces it will launch the new EnviroMark 919G (EM919G) lead-free solder paste in Hall A4, Stand 363 at the upcoming Productronica 2007 exhibition and conference, scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.
Industry News | 2009-03-05 15:03:01.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces the development of SN100C P520 D5 lead-free solder paste for 0402 metric chip components.
Industry News | 2010-10-26 22:46:06.0
FCT Assembly introduces the new NC676 no-clean leaded solder paste, featuring its latest technology in print and reflow in the no-clean category.
Industry News | 2008-02-29 16:42:42.0
ITASCA, IL � January 7, 2008 � Kester will provide lead-free resources, technologies and products in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Los Vegas.
Industry News | 2008-04-07 20:17:14.0
ITASCA, IL � February 29, 2008 � Kester announces it will showcase EnviroMark 923 (EM923), a halogen-free, RoHS Compliant lead-free no-clean solder paste, in booth 2C04 at the upcoming NEPCON China/EMT China 2008 exhibition and conference -scheduled to take place April 8-11, 2008 in Shanghai, PR China.
Industry News | 2009-03-10 16:11:29.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2009-12-10 01:05:59.0
Building on its successful lead-free solder products portfolio, Henkel has developed Multicore LF730, a Pb-free solder paste born from the company’s unyielding innovation commitment and arguably setting the benchmark for lead-free paste performance.
