Industry News: how cure glue (Page 6 of 29)

Engineered Conductive Materials Introduces Spot Curing Conductive Adhesive DB-1590

Industry News | 2012-04-13 19:02:54.0

Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, debuts the fast curing conductive adhesive DB-1590 for use as a solder replacement in next-generation crystalline silicon solar modules using thinned silicon and/or plated bus bars

ECM Equipment Sales, Inc.

Engineered Conductive Materials Launches Fast Curing High Tg Conductive Adhesive CA-100 for Ribbon Stringing CIGS Solar Modules

Industry News | 2012-08-10 07:00:10.0

Engineered Conductive Materials introduces its new fast curing Conductive Adhesive CA-100 for stringing and bussing next-generation CIGS solar modules.

Engineered Materials Systems, Inc.

Engineered Material Systems Introduces Die Attach for Temperature-Sensitive Applications

Industry News | 2013-02-26 16:18:07.0

Engineered Material Systems debuts its DB-1568-1 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices.

Engineered Conductive Materials, LLC

Engineered Material Systems Debuts CA-180 Low-Temperature Cure Conductive Adhesive

Industry News | 2015-05-04 16:04:54.0

Engineered Material Systems introduces its newest conductive adhesive – CA-180. The low-temperature cure conductive adhesive has been designed for die attach and general circuit assembly applications.

Engineered Materials Systems, Inc.

Engineered Materials Systems Introduces Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Industry News | 2015-05-18 20:52:11.0

Engineered Materials Systems introduced its new EMS 561-147-2 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-147-2 is designed to electrically interconnect solar cells using ribbons or direct cell to cell contact.

Engineered Materials Systems, Inc.

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Industry News | 2016-11-14 19:45:24.0

Engineered Materials Systems is pleased to introduce its new EMS 561-567 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-567 is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.

Engineered Materials Systems, Inc.

Engineered Material Systems Introduces a New Low-Temperature Cure Electrically Conductive Adhesive

Industry News | 2017-12-03 18:33:48.0

Engineered Material Systems is pleased to debut its CA-183 low temperature cure electrically conductive adhesive. The low cost, flexible adhesive is designed for die attach and general circuit assembly applications.

Engineered Materials Systems, Inc.

Find Out How to Get the Best Value from Speedprint at SMTA International

Industry News | 2012-09-13 07:33:14.0

Speedprint Technology will exhibit in booth 622 at the upcoming SMTA International Conference and Expo

Speedprint Technology

Essemtec Wins the 2017 NPI Award for Multifunction Placement for the New FOX2

Industry News | 2017-02-21 15:59:49.0

Essemtec announces that it has been awarded a 2017 NPI Award in the category of Component Placement – Multifunction for its FOX2. The award was presented to the company during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. This marks the 15th industry award that the Swiss manufacturer has received in recognition of its production systems for electronic assembly and packaging. The new FOX2 by Essemtec combines jetting of solder paste or glue and placement in a single machine. The new version is based on the original award-winning platform, which is the first machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments.

ESSEMTEC AG

Essemtec Wins NPI Award for Tarantula All Terrain Jet Dispenser

Industry News | 2018-02-28 08:22:00.0

Essemtec has been awarded a 2018 NPI Award in the category of Dispensing for its Tarantula – Relentless All Terrain Jet Dispenser. The system features state-of-the-art technology and can be easily integrated in any line. It is designed for a wide range of dispensing applications such as solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.

ESSEMTEC AG


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