Industry News: how long can you leave solder paste? (Page 1 of 4)

What are the operating steps of the Full-auto SMT Stencil Printer in SMT Production Line?

Industry News | 2022-11-22 06:14:08.0

Full-auto SMT Stencil Printer is indispensable equipment in SMT production Line. It is generally composed of board mounting, solder paste, imprinting, and circuit board transfer. Widely used are Full-auto SMT Stencil Printer and semi-auto SMT Stencil Printer These two types, next, let's share with you the operating instructions of Full-auto SMT Stencil Printer.

Dongguan Intercontinental Technology Co., Ltd.

LED Factory Upgrade Driven By The Belt and Road Environment

Industry News | 2023-07-22 06:07:51.0

Revamp your LED factory with the Belt and Road environment in mind. Embrace innovation and sustainability as you upgrade your LED production capabilities. Explore how the Belt and Road initiative is driving positive changes in the LED industry, and stay ahead in the global market with our advanced solutions.

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

I.C.T SMT Process Fully Automatic SMT Line

Industry News | 2023-07-22 03:28:31.0

Streamline your SMT process with I.C.T's Fully Automatic SMT Line. Experience efficiency and precision in surface mount technology with our state-of-the-art equipment. Enhance your production capabilities and stay ahead in the competitive market with our cutting-edge SMT solutions.

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

What's usage of Via tenting for PCB design?

Industry News | 2019-11-05 22:07:01.0

Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.

Headpcb

Douglas Winther celebrates 50 years with Technical Devices Company

Industry News | 2013-03-06 10:22:37.0

On March 12, 1963; Douglas Winther began working at Technical Devices Company as a shop helper. Mrs. Margaret Winther gave her 18 year old son some advice that day as he headed off to his first job, “When you are at work - work hard. Get there before your boss does and leave after your boss leaves.”

Technical Devices Company

Second generation of the MY500 at Productronica 2007 MY500 � jet printing technology for higher profitability.

Industry News | 2007-11-05 12:22:30.0

With greater PCB design flexibility, more precise solder paste placement and complete off-line preparation, the second generation of the MY500 offers you a vast array of ways to improve your profitability.

Mycronic Technologies AB

Second generation of the MY500 at APEX 2008 MY500 � Jet Printing technology for higher profitability

Industry News | 2008-04-08 22:40:58.0

With greater PCB design flexibility, more precise solder paste placement and complete off-line preparation, the second generation of the MY500 offers you a vast array of ways to improve your profitability.

Mycronic Technologies AB

Visit SHENMAO at the SMTA Long Island Conference & Exhibition

Industry News | 2019-10-08 06:05:58.0

SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Long Island Expo & Tech Forum, scheduled to take place Thursday, October 17, 2019 at the Melville Marriott in Melville, NY. The company will showcase its PF735-PQ10 low temperature solder (LTS) and SM-862 Liquid Flux.

Shenmao Technology Inc.

AIM Solder to Exhibit NC259 Solder Paste at SMT Hybrid Packaging 2013

Industry News | 2013-03-18 17:06:13.0

AIM Solder announces that it will highlight its new NC259 Solder Paste in representative smartTec GmbH’s booth, which is located in Hall 7, Booth 219 at the upcoming SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

AIM Solder

Why use Via in Pad Design?

Industry News | 2019-11-05 22:08:21.0

Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.

Headpcb

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