Industry News: how many reflow cycles for hr370 (Page 1 of 5)

MAPICS and Georgia Tech Lead Groundbreaking Advancements for Electronics Manufacturers

Industry News | 2003-03-19 08:25:45.0

Pilot Program Facilitates Information Exchange Standards in Electronics Manufacturing Industry

SMTnet

Advantages of Design for Manufacturability Rules

Industry News | 2018-10-18 11:09:41.0

Advantages of Design for Manufacturability Rules

Flason Electronic Co.,limited

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Industry News | 2018-12-08 03:27:35.0

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Flason Electronic Co.,limited

Symposium on Counterfeit Parts and Materials Call for Abstracts

Industry News | 2017-01-20 14:26:47.0

The SMTA and CALCE are pleased to announce the Call for Abstracts for the Symposium on Counterfeit Parts and Materials June 27-29, 2017 in College Park, Maryland. The deadline to submit an abstract is March 20, 2017.

Surface Mount Technology Association (SMTA)

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)

Making Readable Silkscreen Layouts for your Printed Circuit Board (PCB) Design

Industry News | 2018-10-18 11:18:14.0

Making Readable Silkscreen Layouts for your Printed Circuit Board (PCB) Design

Flason Electronic Co.,limited

Cleaning Up the No-Clean Myth - IPC Releases New Update of Guidelines for Cleaning of Printed Boards & Assemblies

Industry News | 2011-07-26 22:29:00.0

It’s well-known that residues on printed board assemblies can lead to serious reliability problems. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.

Association Connecting Electronics Industries (IPC)

Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors

Industry News | 2018-10-18 09:06:41.0

Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors

Flason Electronic Co.,limited

SMT solder joint quality and appearance inspection process

Industry News | 2018-10-18 08:00:40.0

SMT solder joint quality and appearance inspection process

Flason Electronic Co.,limited

SMT solder joint quality and appearance inspection process

Industry News | 2018-10-18 08:01:00.0

SMT solder joint quality and appearance inspection process

Flason Electronic Co.,limited

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