Industry News: how many times can you solder a component (Page 9 of 27)

MAGNALYTIX® to Present Three Papers during SMTAI Virtual Conference

Industry News | 2020-09-17 11:48:34.0

MAGNALYTIX® today announced its participation in the SMTA International Virtual Conference & Expo. The Live Virtual Exposition is scheduled to take place Sept. 28-30, 2020 where you will have access to chat live with a MAGNALYTIX team member and the On-Demand Conference & Expo will take place Sept. 28-Oct 23, 2020. The MAGNALYTIX team will present three papers during the On-Demand Conference.

Magnalytix

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Industry News | 2018-12-08 03:27:35.0

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Flason Electronic Co.,limited

The necessity of X-ray inspection for SMT BGA soldering quality control

Industry News | 2021-06-10 02:42:13.0

With the advent of 5G, especially the high integration, high density, miniaturization of packaging, and high process requirements in the electronics industry, detection efficiency is particularly important. Many manufacturers are not particularly clear about what role X-Ray can play and how to use X-Ray to improve the process and reduce the defect rate. Most manufacturers buy X-Ray because of the needs of customers. Those who are forced to buy X-Ray alone do not actually understand the important role that X-Ray can play in the production line.

Unicomp Technology Co., Ltd

"The Cobra will delight our visitors" - Interview with Georges Bouvier, Business Manager of Essemtec France

Industry News | 2011-05-23 15:11:40.0

Essemtec France has been operational since the beginning of 2011 and will be technically and administratively independent from Essemtec Switzerland by the third quarter this year. Adrian Schärli spoke with Georges Bouvier, Business Manager, about the reasons for founding Essemtec France, his targets and the future vision.

ESSEMTEC AG

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

Why use Via in Pad Design?

Industry News | 2019-11-05 22:08:21.0

Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.

Headpcb

Catching up with PNC

Industry News | 2015-11-16 10:47:48.0

Catching up with PNC with Dan Beaulieu, D.B. Management Group

PNC Inc.

Solectron takes advantage of downturn to regroup

Industry News | 2001-10-31 07:22:21.0

EMS company outlines consolidation, vertical integration plans

Solectron

Indium Corporation Announces Spanish-Language Voiding Workshop Webinar

Industry News | 2020-09-06 04:29:53.0

Indium Corporation's Iván Castellanos, Technical Services Manager for Latin America, will host an Avoid the Void® InSIDER Series workshop on how to avoid voiding in bottom termination components (BTCs) on Tuesday, September 22 at 12 p.m. Central Time (Mexico)/7 p.m. Central European Summer Time (Madrid, Spain).

Indium Corporation

MYDATA meets demand for smarter information management with intuitive new MYCenter software.

Industry News | 2013-02-06 13:10:47.0

MYDATA recently announced the release of MYCenter 2.1, a next-generation software solution that helps to improve control and efficiency in SMT production. Further strengthening what is already one of the most comprehensive software suites in the industry, the solution offers SMT manufacturers a robust platform with three modules that can be integrated into all types of production environments.

Mycronic Technologies AB


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