Industry News | 2013-10-25 17:55:58.0
Nordson YESTECH,a subsidiary of Nordson Corporation (Nasdaq: NDSN) will feature the FX SL AOI in Hall A2, Stand 438 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2010-08-27 23:44:39.0
From August 31 to September 2, ATE China 2010 will be held at the Shenzhen Exhibition Center and MV, a very popular field right now, will be the focus of the exhibition.
Industry News | 2016-09-13 21:04:26.0
Engineered Materials Systems today announced its new EMS 561-338 Fast Cure Conductive Adhesive for die attach applications with small to medium size die. EMS 561-338 is designed to cure in less than one minute at 150ºC.
Industry News | 2016-11-15 18:10:16.0
Engineered Materials Systems today announced its new EMS 561-854 Fast Cure Conductive Adhesive for die-attach applications with small- to medium-size die and tantalum capacitors. EMS 561-854 is designed to cure in one minute at 170ºC.
Industry News | 2018-08-01 20:06:07.0
optical control today announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 28-30, 2018 at the Shenzhen Convention & Exhibition Center. Company representatives will demonstrate the OC-SCAN®CCX.3 component counter in Stand 1C03 in cooperation with Suzhou Link Ways Tech Co., Ltd.
Industry News | 2013-09-25 12:31:43.0
FCT Assembly today announced that Bob Dervaes, VP of technology and engineering, will present “SMT Assembly Challenges and Proven Solutions for Increasing Yields” during Spotlight 4 “Process and Yield Improvement in SMT” at SMTA International in Fort Worth, TX.
Industry News | 2018-11-27 07:02:53.0
Naprotek today announced plans to exhibit at the SMTA Silicon Valley Expo & Tech Forum, scheduled to take place Wednesday, Nov. 28, 2018 at Bestronics, Inc. in San Jose, CA.
Industry News | 2010-03-27 17:37:02.0
TORRANCE, CA - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will feature its leading machinery in booth 407 at the upcoming IPC/APEX conference and exhibition.
Industry News | 2009-03-18 14:23:09.0
Fine Line Stencil will introduce the UltraSlic™ FG solder paste stencil, which sets new stencil performance standards, in booth 846 at the upcoming APEX 2009 exhibition & conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.
Industry News | 2022-08-14 14:06:55.0
STI Electronics, Inc. announces it will present "Advanced SMT Workshop, A Comprehensive Review of the SMT Electronics Assembly Process." The four-day workshop will be held October 10-13, 2022 and consists of four classes for the electronics industry.
