Industry News: how to cost a line (Page 83 of 164)

Meet with KYZEN in Person at SMTAI to Discuss the Process Care Line

Industry News | 2021-10-04 13:37:14.0

KYZEN will exhibit in Booth #3325 during the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN.

KYZEN Corporation

Indium Corporation's Dr. Lee to Present at Pan Pacific Microelectronics Symposium

Industry News | 2009-01-21 20:01:04.0

Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present two papers, A Novel Flexible Ag (Silver) Paste and Next Level Requirements for Ultra Fine Pitch Printing, at the Pan Pacific Microelectronics Symposium held on the Big Island of Hawaii, February 10-12, 2009.

Indium Corporation

Nihon Superior’s President Tetsuro Nishimura to Present at SMTA Pan Pacific Microelectronics Symposium 2012

Industry News | 2012-01-13 12:58:39.0

Nihon Superior announces that President Tetsuro Nishimura will present two papers at the upcoming SMTA Pan Pacific Microelectronics Symposium, scheduled to take place February 14-16, 2012 at the Sheraton Poipu Resort in Kauai, Hawaii.

Nihon Superior Co., Ltd.

EVS International to Demonstrate Unprecedented Solder Recovery at the Penang Manufacturing Expo 2024

Industry News | 2024-07-08 11:25:59.0

EVS International is pleased to announce its participation in the Penang Manufacturing Expo 2024, taking place July 24-26, 2024, at the Setia SPICE Convention Centre in Penang. Attendees can visit EVS International at the Qualitek Solution Booth A88, to experience the EVS 500LFCABF with Automated Dross Chute & Fume Extraction.

EVS International

Ventec’s Martin Cotton to present paper on PCB Design Process at SMART Group European Conference

Industry News | 2015-09-10 17:02:54.0

Ventec Europe will present a paper entitled 'Making the right decisions at the right time in the PCB design process' at the 2015 SMART Group European Conference & Exhibition. The conference will be held on the 22-23rd September at the National Physical Laboratory (NPL), one of the UK’s leading science and research facilities, located in Teddington, London.

Ventec International Group

Indium Corporation to Feature Four Presentations at SMTA Pan Pacific

Industry News | 2022-12-21 11:02:58.0

Indium Corporation will share a variety of presentations on insightful topics ranging from artificial intelligence, the capabilities of gallium, advanced materials, and more, at the SMTA Pan Pacific Microelectronics Symposium (SMTA PanPac), Jan. 30-Feb. 2, Kauai, Hawaii, U.S.

Indium Corporation

Metcal brings innovative benchtop soldering systems to NEPCON China

Industry News | 2018-03-22 20:55:09.0

Metcal announces plans to exhibit in Stand 1F38 at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will show its Connection Validation (CV) Soldering System with new hand-pieces, Digital Hot Air Pencil, High Thermal Demand solution and Solder Tip Cleaner.

Metcal

Data I/O to Exhibit Programming Solutions at the SMTA Upper Midwest Expo & Tech Forum

Industry News | 2011-05-19 18:16:53.0

Data I/O Corporation will showcase its FlashPak III and ProLINE-RoadRunner™ at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 9, 2011 at the Sheraton Bloomington Hotel in Bloomington, MN.

Data I/O Corporation

FCT Solder to Exhibit Its SN100C Products and Technologies at Mexitr�nica 2008

Industry News | 2008-10-07 21:14:49.0

GREELEY, CO � October 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, announces that it will showcase its line of SN100C products and technologies with Nihon Superior Co. Ltd. in booth 402 at the upcoming Mexitr�nica exhibition scheduled to take place October 21-23, 2008 at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, Mexico.

FCT ASSEMBLY, INC.

Essemtec’s Technology Day to Highlight Future Dispensing and MID Technologies

Industry News | 2012-11-06 11:22:15.0

Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.

ESSEMTEC AG


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