Industry News: humidity (Page 20 of 35)

Christopher Associates/Beijing Tonsan Adhesive Co. Ltd. to Present Evaluation of Sealants used in Photovoltaic Module Manufacture at AIMS/Harsh Environments Symposium at SMTAI 2010

Industry News | 2010-09-26 15:48:56.0

Christopher Associates/Beijing Tonsan Adhesive Co. Ltd. announces that Jasbir Bath will present a paper titled “An Evaluation of Sealants used in Photovoltaic (PV) Module Manufacture” at the upcoming AIMS/Harsh Environments Symposium at the SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Christopher Associates Inc.

FCT Assembly Debuts NC676 No-Clean Leaded Solder Paste

Industry News | 2010-10-26 22:46:06.0

FCT Assembly introduces the new NC676 no-clean leaded solder paste, featuring its latest technology in print and reflow in the no-clean category.

FCT ASSEMBLY, INC.

STI Electronics Inc’s SIR Test Protocol Receives Prestigious Global Technology Award

Industry News | 2010-10-27 18:18:54.0

STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that it has been awarded a Global Technology Award in the category of Contract Services

STI Electronics

Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering

Industry News | 2010-12-03 22:31:01.0

Endicott Interconnect Technologies, Inc. (EI) announced today that the Company has added Liquid Crystal Polymer (LCP) Laminates to its family of microelectronics packaging product offerings.

i3 Electronics

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Circuit Assembly Applications

Industry News | 2012-02-22 01:32:21.0

Engineered Material Systems introduces its DE-7826 (dam) and CE-7826 (fill) Dam and Fill Chip Encapsulants for chip-on-board (COB) applications.

Engineered Materials Systems, Inc.

ACD Strengthens Test Capabilities with Addition of a Tenney Jr. Test Chamber

Industry News | 2012-08-07 10:51:45.0

ACD,announces a new addition to its test department — a Tenney Jr. Model TUJR Test Chamber.

Automated Circuit Design (ACD)

Seika to Participate at the SMTA Arizona Expo & Tech Forum

Industry News | 2013-10-21 14:01:05.0

Seika Machinery, Inc. announces that it will highlight the its McDry Cabinets and the Sayaka SAM-CT23W at the SMTA Arizona Expo & Tech Forum, schedule to take place Wednesday, November 20, 2013 at the DoubleTree by Hilton Phoenix - Tempe.

Seika Machinery, Inc.

Seika Goes to the SMTA Carolinas Expo & Tech Forum

Industry News | 2014-01-09 11:15:15.0

Seika Machinery, Inc. announces that it will attend the SMTA Carolinas Expo & Tech Forum, scheduled to take place Thursday, January 23, 2014 at the Double Tree Raleigh Brownstone – University in Raleigh, NC. Seika will highlight the new HIOKI 1240 Flying Probe Tester and proven McDry Cabinets.

Seika Machinery, Inc.

Essemtec Launches the New CUBUS Storage Solution at SMT in Nuremberg

Industry News | 2014-04-08 10:37:08.0

Essemteclaunches CUBUS, its next-generation storage tower, at SMT 2014 in Nuremberg.

ESSEMTEC AG

VJ Electronix Appoints W-Tech for Sales of XQuik with AccuCount

Industry News | 2015-09-10 08:25:29.0

VJ Electronix is pleased to announce that it has appointed W-Tech as its newest distributor for the XQuik with AccuCount in Europe.

VJ Electronix


humidity searches for Companies, Equipment, Machines, Suppliers & Information

DriSteem
DriSteem

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Manufacturer

14949 Technology Drive
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Phone: 952-949-2415

pressure curing ovens

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