Industry News | 2016-04-20 18:15:34.0
Nordson ASYMTEK will present a triple-valve, closed-loop system to jet conformal coating, a UV oven to cure it, and an automated coating inspection system to verify the coating results at the SMT Hybrid Packaging Show in Nuremberg, Germany, in the smartTec stand 7-109 from 26-28 April 2016. Nordson ASYMTEK's award-winning Quantum® Q-6800 high-performance, large-format dispensing system will jet underfill as part of the show's Future Packaging Line at stand 6-434.
Industry News | 2011-06-22 00:31:49.0
JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of a significant revision of its standard for Inspection Criteria for Microelectronic Packages and Covers, JESD9B.
Industry News | 2005-02-03 17:41:37.0
David Sbiroli, Senior Applications Engineer with Indium Corporation of America, will be presenting at the IMAPS 2005 Symposium
Industry News | 2009-09-23 21:53:53.0
Advanced Techniques US (ATCO)announces the development of an AT-GDP Series BGA Rework Station. Precise mechanics coupled with a comprehensive software package automates the device removal and installation processes. This model handles both leaded and lead-free applications consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s.
Industry News | 2017-06-20 19:57:45.0
Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, today announced the appointment of Lou Razzetti of AVID Associates as the newest addition to their rep team, covering all of DE, MD, VA, Washington, DC and some of PA.
Industry News | 2019-05-15 17:09:30.0
NEO Tech announces that it will highlight its high-reliability microelectronics solutions and higher level integration experience at the 2019 Space Tech Expo, which is scheduled to take place May 21-22, 2019 at the Pasadena Convention Center in California.
Industry News | 2016-03-17 14:24:23.0
Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg, Germany.
Industry News | 2010-10-14 17:28:24.0
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, will feature its key engineering services at the upcoming Lockheed Martin LM Connect Conference.
Industry News | 2010-10-29 23:55:24.0
STI Electronics, Inc. will highlight its key engineering services in Booth 119 at the upcoming Defense Manufacturing Conference, scheduled to take place November 29-December 2, 2010 at The Venetian in Las Vegas, NV.
Industry News | 2011-02-10 13:13:56.0
JEDEC Solid State Technology Association announces that its JC-45 Committee for DRAM Modules intends to form a new Subcommittee focused on the standardization of hybrid memory modules.
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