Industry News: hybrid microelectronics (Page 1 of 6)

JEDEC Announces Publication of Inspection Criteria for Microelectronic Packages and Covers (JESD9B)

Industry News | 2011-06-22 00:31:49.0

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of a significant revision of its standard for Inspection Criteria for Microelectronic Packages and Covers, JESD9B.

JEDEC Solid State Technology Association

Indium�s David Sbiroli to Present at IMAPS Symposium

Industry News | 2005-02-03 17:41:37.0

David Sbiroli, Senior Applications Engineer with Indium Corporation of America, will be presenting at the IMAPS 2005 Symposium

Indium Corporation

New AT-GDP Series BGA Rework Station Provides the Latest Precision and Process Control

Industry News | 2009-09-23 21:53:53.0

Advanced Techniques US (ATCO)announces the development of an AT-GDP Series BGA Rework Station. Precise mechanics coupled with a comprehensive software package automates the device removal and installation processes. This model handles both leaded and lead-free applications consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s.

Advanced Techniques US Inc. (ATCO)

Hanwha Techwin Appoints AVID Associates as Northeastern Rep

Industry News | 2017-06-20 19:57:45.0

Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, today announced the appointment of Lou Razzetti of AVID Associates as the newest addition to their rep team, covering all of DE, MD, VA, Washington, DC and some of PA.

Hanwha Techwin CO., LTD.

NEO Tech to Focus on Space-Qualified Capabilities during Space Tech Expo 2019

Industry News | 2019-05-15 17:09:30.0

NEO Tech announces that it will highlight its high-reliability microelectronics solutions and higher level integration experience at the 2019 Space Tech Expo, which is scheduled to take place May 21-22, 2019 at the Pasadena Convention Center in California.

NEO Technology Solutions (NEO Tech)

Indium Corporation VP of Technology to Present at SMT Hybrid Packaging

Industry News | 2016-03-17 14:24:23.0

Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg, Germany.

Indium Corporation

See STI Electronics’ Engineering Services Division at Lockheed Martin LM Connect 2010

Industry News | 2010-10-14 17:28:24.0

STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, will feature its key engineering services at the upcoming Lockheed Martin LM Connect Conference.

STI Electronics

STI Electronics to Highlight Key Engineering Services at the 2010 Defense Manufacturing Conference

Industry News | 2010-10-29 23:55:24.0

STI Electronics, Inc. will highlight its key engineering services in Booth 119 at the upcoming Defense Manufacturing Conference, scheduled to take place November 29-December 2, 2010 at The Venetian in Las Vegas, NV.

STI Electronics

JEDEC to Standardize Hybrid Memory Modules

Industry News | 2011-02-10 13:13:56.0

JEDEC Solid State Technology Association announces that its JC-45 Committee for DRAM Modules intends to form a new Subcommittee focused on the standardization of hybrid memory modules.

JEDEC Solid State Technology Association

STI Electronics’ Quality Assurance Manager Celebrates 10th Anniversary

Industry News | 2010-11-12 15:29:53.0

STI Electronics announces the 10-year anniversary of Mel Scott, Quality Assurance Manager. In honor of his anniversary, Mel was presented with a travel certificate to be used for a cruise or travel destination of his choice.

STI Electronics


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